6.3
Thermal Monitor..................................................................................................74
6.3.1 Thermal Diode........................................................................................76
7
8
Boxed Processor Specifications.......................................................................77
7.1
7.2
Introduction .........................................................................................................77
Mechanical Specifications...................................................................................78
7.2.1 Boxed Processor Cooling Solution Dimensions.....................................78
7.2.2 Boxed Processor Fan Heatsink Weight..................................................79
7.2.3 Boxed Processor Retention Mechanism and Heatsink Assembly..........79
Electrical Requirements ......................................................................................80
7.3.1 Fan Heatsink Power Supply...................................................................80
Thermal Specifications........................................................................................82
7.4.1 Boxed Processor Cooling Requirements ...............................................82
7.4.2 Variable Speed Fan ...............................................................................83
7.3
7.4
Debug Tools Specifications.................................................................................85
8.1
Logic Analyzer Interface (LAI).............................................................................85
8.1.1 Mechanical Considerations....................................................................85
8.1.2 Electrical Considerations........................................................................85
4
Intel® Pentium® 4 Processor on 0.13 Micron Process Datasheet