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27C256-20/SO PDF预览

27C256-20/SO

更新时间: 2024-09-25 03:55:51
品牌 Logo 应用领域
美国微芯 - MICROCHIP 可编程只读存储器电动程控只读存储器
页数 文件大小 规格书
10页 92K
描述
256K (32K x 8) CMOS EPROM

27C256-20/SO 数据手册

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Obsolete Device  
27C256  
256K (32K x 8) CMOS EPROM  
FEATURES  
PACKAGE TYPES  
• High speed performance  
PLCC  
- 90 ns access time available  
• CMOS Technology for low power consumption  
- 20 mA Active current  
5
29  
28  
27  
26  
25  
24  
23  
22  
21  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
NC  
A8  
A9  
6
- 100 µA Standby current  
7
A11  
NC  
OE  
A10  
CE  
O7  
O6  
8
• Factory programming available  
• Auto-insertion-compatible plastic packages  
• Auto ID aids automated programming  
• Separate chip enable and output enable controls  
• High speed “express” programming algorithm  
• Organized 32K x 8: JEDEC standard pinouts  
- 28-pin Dual-in-line package  
9
10  
11  
12  
13  
O0  
DIP/SOIC  
VPP  
A12  
A7  
- 32-pin PLCC Package  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
VCC  
A14  
A13  
A8  
2
- 28-pin SOIC package  
3
A6  
4
- Tape and reel  
A5  
5
A9  
• Data Retention > 200 years  
A4  
6
A11  
OE  
A10  
CE  
O7  
A3  
7
• Available for the following temperature ranges:  
A2  
8
A1  
9
- Commercial:  
- Industrial:  
0°C to +70°C  
A0  
10  
11  
12  
13  
14  
-40°C to +85°C  
-40°C to +125°C  
O0  
O1  
O2  
VSS  
O6  
O5  
- Automotive:  
O4  
O3  
DESCRIPTION  
The Microchip Technology Inc. 27C256 is a CMOS  
256K bit electrically Programmable Read Only Memory  
(EPROM). The device is organized as 32K words by 8  
bits (32K bytes). Accessing individual bytes from an  
address transition or from power-up (chip enable pin  
going low) is accomplished in less than 90 ns. This very  
high speed device allows the most sophisticated micro-  
processors to run at full speed without the need for  
WAIT states. CMOS design and processing enables  
this part to be used in systems where reduced power  
consumption and reliability are requirements.  
A complete family of packages is offered to provide the  
most flexibility in applications. For surface mount appli-  
cations, PLCC, or SOIC packaging is available. Tape  
and reel packaging is also available for PLCC or SOIC  
packages.  
2004 Microchip Technology Inc.  
DS11001N-page 1  

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