Data Sheet
June 2001
269-Type 1480 nm Pump Laser Module
Mounting and Connections
User Information
Table 4. Pin Information
CAUTION: This device is susceptible to damage as
a result of electrostatic discharge.
Pin
Number
Proper precautions should be taken
during both handling and testing.
Connection
1
2
TE Cooler (+)*
Thermistor
The base of the laser module (see Outline Diagram)
should be maintained at or below 75 °C (maximum)
during operation. Interfaces between the laser module
base and heat sink must be clean, and the use of a
thermal filler may be necessary.
3
4
5
Monitor Anode (–Bias)
Monitor Cathode (+Bias)
Thermistor
6
No Connect
7
No Connect
8
9
No Connect
No Connect
Mounting Instructions
10
11
12
13
14
Laser Anode (+)
Laser Cathode (–)
No Connect
Package Ground
TEC Cooler (–)
The minimum fiber bend radius is 1.0 in.
To avoid degradation in performance, mount the mod-
ule on the board as follows:
1. Place the bottom flange of the module on a flat heat
sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm)
in size. The surface finish of the heat sink should be
better than 32 µin. (0.8 µm), and the surface flat-
ness must be better than 0.001 in. (25.4 µm). Using
thermal conductive grease is optional; however,
thermal performance may be improved if conductive
grease is applied between the bottom flange and
the heat sink.
* A positive input into this pin cools the laser.
Fiber Characteristics
■ Length of fiber pigtail:
— 1.75 m ± 0.25 m
■ Standard fiber:
2. Mount four #2-56 screws with Fillister heads
(M2-3 mm) at the four screw hole locations (see
Outline Diagram). The Fillister head diameter must
not exceed 0.140 in. (3.55 mm). Do not apply more
than 1 in./lb. of torque to the screws.
— Cladding OD: 125 µm ± 2 µm
— Acrylate buffer OD: 250 µm ± 15 µm
— Cut off wavelength: <1320 nm
■ Polarization-maintaining fiber:
— PANDA
— Cut off wavelength: <1400 nm
— Acrylate buffer: 400 µm
7
6
5
4
3
2
1
–
+
TEC
TH 10 kΩ
ISOLATOR
(OPTIONAL)
–
+
1-675 (F).i
8
9
10
11
12
13
14
Figure 1. Circuit Schematic
5
Agere Systems Inc.