DieleCTRiC
CHaRaCTeRiSTiCS
npo
x7R
TEMPERATURE COEFFICIENT:
QUALITY FACTOR / DF:
0
30ppm /°C, -55 to 125°C
15%, -55 to 125°C
Q
>1,000 @ 1 MHz, Typical 10,000
16VDC Dp≤ 3.5% @ 1 KHz, 25°C
10VDC Dp≤ 5.0% @ 1 KHz, 25°C
INSULATION RESISTANCE:
DIELECTRIC STRENGTH:
>100 GΩ @ 25°C,WVDC;
>500 ΩF* or 10 GΩ* @ 25°C,WVDC;
125°C IR is 10% of 25°C rating
* whichever is less
125°C IR is 10% of 25°C rating
500 V ≤ 2.5 X WVDC Min., 25°C, 50 mA max
1000 V ≤ 1.5 X WVDC Min., 25°C, 50 mA max
> 1500 = 1 X WVDC Min., 25°C, 50 mA max
2.5 X WVDC Min., 25°C, 50 mA max
1KHz 50Hz, 1.0 0.2 VRMS, 25°C
100 - 10,000 pF
TEST PARAMETERS::
1MHz 50kHz, 1.0 0.2 VRMS, 25°C
AVAILABLE CAPACITANCE:
Size 01005: 0.2 - 10 pF
Size 0201: 0.2 - 100 pF
Size 0402: 0.2 - 33 pF
Size 0603: 0.2 - 100 pF
Size 0805: 0.3 - 220 pF
Size 1111: 0.2 - 1000 pF
Size 2525: 1.0 - 2700 pF
Size 3838: 1.0 - 5100 pF
MECHANICAL & ENVIRONMENTAL
CHARACTERISTICS
SPECIFICATION
TEST PARAMETERS
SOLDERABILITY:
Solder coverage ≥ 90% of metalized areas
No termination degradation
Preheat chip to 120°-150°C for 60 sec., dip terminals in rosin flux
then dip in Sn62 solder @ 240° 5°C for 5 1 sec
RESISTANCE TO
SOLDERING HEAT:
No mechanical damage
Capacitance change: 2.5% or 0.25pF
Q>500 I.R. >10 G Ohms
Preheat device to 80°-100°C for 60 sec.
followed by 150°-180°C for 60 sec.
Dip in 260° 5°C solder for 10 1 sec.
Measure after 24 2 hour cooling period
Breakdown voltage: 2.5 x WVDC
TERMINAL
ADHESION:
Termination should not pull off.
Ceramic should remain undamaged.
Linear pull force* exerted on axial leads soldered to each terminal.
*0402 ≥ 2.0lbs, 0603 ≥ 2.0lbs (min.)
PCB DEFLECTION:
No mechanical damage.
Capacitance change: 2% or 0.5pF Max
Glass epoxy PCB: 0.5 mm deflection
LIFE TEST:
MIL-STD-202, Method 108l
No mechanical damage
Capacitance change: 3.0% or 0.3 pF
Q>500 I.R. >1 G Ohms
Applied voltage: 120% of WDVC for capacitors rated at 500 volts DC or less.
100% of WDVC for capacitors rated at 1250 volts DC or less.
Temperature: 125° 3°C
Test time: 1000+48-0 hours
Breakdown voltage: 2.5 x WVDC
THERMAL CYCLE:
No mechanical damage.
Capacitance change: 2.5% or 0.25pF
Q>2000 I.R. >10 G Ohms
5 cycles of: 30 3 minutes @ -55°+0/-3°C,
2-3 min. @ 25°C, 30 3 min. @ +125°+3/-0°C,
2-3 min. @ 25°C
Breakdown voltage: 2.5 x WVDC
Measure after 24 2 hour cooling period
HUMIDITY,
STEADY STATE:
No mechanical damage.
Relative humidity: 90-95%
Temperature: 40° 2°C
Test time: 500 +12/-0 Hours
Measure after 24 2 hour cooling period
Capacitance change: 5.0% or 0.50pF max.
Q>300 I.R. ≥ 1 G-Ohm
Breakdown voltage: 2.5 x WVDC
HUMIDITY,
LOW VOLTAGE:
No mechanical damage.
Capacitance change: 5.0% or 0.50pF max.
Q>300 I.R. = 1 G-Ohm min.
Applied voltage: 1.5 VDC, 50 mA max.
Relative humidity: 85 2% Temperature: 40° 2°C
Test time: 240 +12/-0 Hours
Breakdown voltage: 2.5 x WVDC
Measure after 24 2 hour cooling period
VIBRATION:
No mechanical damage.
Capacitance change: 2.5% or 0.25pF
Q>1000 I.R. ≥ 10 G-Ohm
Breakdown voltage: 2.5 x WVDC
Cycle performed for 2 hours in each of three perpendicular directions
Frequency range 10Hz to 55 Hz to 10 Hz traversed
in 1 minute. Harmonic motion amplitude: 1.5mm
10
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