2508051217Y6 PDF预览

2508051217Y6

更新时间: 2025-09-22 18:53:27
品牌 Logo 应用领域
飞来 - FAIR-RITE /
页数 文件大小 规格书
3页 376K
描述
Chip Beads (2508051217Y6)

2508051217Y6 数据手册

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Chip Beads (2508051217Y6)  
Part Number: 2508051217Y6  
MULTI-LAYER CHIP BEAD  
Fair-Rite offers a broad selection of cost effective multi-layer chip beads to suppress conducted EMI  
signals. Chip beads can be used in an array of devices such as cellular phones, computers, laptops,  
pagers, etc. The small package sizes accommodate automated placements and allow for a dense  
packaging of circuit boards.  
Chip Beads are available in standard, high and GHz signal speeds.  
Recommended Soldering Profile  
Packaging Options:  
-All multi-layer chip beads are supplied taped and reeled, if required bulk packed chip beads can be  
provided.  
The suggested land patterns are in accordance to the latest revision of IPC-7351.  
Weight: 0.01 (g)  
Package Size: 0805 (2012)  
Dim mm mm tol nominal inch inch misc.  
Reel Information  
A
B
C
D
0.9 ±0.20 0.035  
1.25 ±0.20 0.049  
_
_
_
_
Tape  
Pitch  
Width  
mm  
Parts 7" Parts 13" Parts  
Reel  
Reel  
14" Reel  
mm  
2
±0.20 0.079  
8
4
4000  
10000  
_
0.5 ±0.30 0.02  

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