IN4678UR-1 thru 1N4717UR-1
(or MLL4678-1 thru MLL4717UR-1)
METALLURGICALLY BONDED GLASS
SURFACE MOUNT 0.5 WATT ZENERS
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
The 1N4678UR-1 thru 1N4717UR-1 series of 0.5 watt glass surface mount
DO-213AA Zener voltage regulators provides a selection from 1.8 to 43 volts
in standard 5% tolerances as well as tighter tolerances with a very low test
current of 50 µA. These have an internal-metallurgical-bond option as
identified with the “-1” suffix. This type of internally bonded Zener package
construction is also available with equivalent military screening as described
in the Features section. Microsemi also offers numerous other Zener
products to meet higher and lower power applications.
DO-213AA
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
• Surface mount equivalent to JEDEC registered 1N4678
•
Regulates voltage over a broad operating current and
thru 1N4717 series
temperature range
• Internal metallurgical bond with the “-1” suffix
•
•
Extensive selection from 1.8 to 43 V
• Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, MSP respectively to
part numbers; (e.g. MX1N4678UR-1, MV1N4701UR-1,
MSP1N4709DUR-1, etc.)
Standard voltage tolerances are plus/minus 5% with
no suffix
•
Tight tolerances available in plus or minus 2% or 1%
with additional C or D suffix respectively
Hermetically sealed surface mount package
Nonsensitive to ESD per MIL-STD-750 Method 1020
Minimal capacitance (see Figure 3)
•
•
•
•
• Nonbonded types also available without the “-1” suffix
for both the axial and surface mount packages
• DO-7 or DO-35 glass body axial-leaded Zener
equivalents also available per JEDEC registration with
part numbers 1N4678 thru 1N4717 on separate data
sheets
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
• Operating and Storage temperature: -65ºC to +175ºC
• CASE: Hermetically sealed glass DO-213AA (SOD80
• Thermal Resistance: 100 ºC/W junction to end cap, or
250ºC/W junction to ambient when mounted on FR4 PC
board (1 oz Cu) with recommended footprint (see last
page Figure 1)
or MLL34) MELF style package
• TERMINALS: End caps tin-lead plated solderable per
MIL-STD-750, method 2026
• POLARITY: Cathode indicated by band where diode
is to be operated with the banded end positive with
respect to the opposite end for Zener regulation
• Steady-State Power: 0.5 watts at end cap temperature
T
EC < 125oC or at ambient TA < 50ºC when mounted on
FR4 PC board as described for thermal resistance
above (see Figure 2 for derating)
• MARKING: cathode band only
• TAPE & REEL option: Standard per EIA-481-1-B with
12 mm tape, 2000 per 7 inch reel or 5000 per 13 inch
reel (add “TR” suffix to part number)
• Forward voltage @100 mA: 1.5 volts
• Solder Temperatures: 260 ºC for 10 s (max)
• WEIGHT: 0.04 grams
• See package dimensions on last page
Copyright 2002
3-12-04 REV A
Microsemi
Page 1
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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