Diode Leadless Chip Carrier - DLCC
Features
The DLCC family of Ceramic Leadless Chip
Carrier packages for Diodes is designed for
all high reliability applications – Space,
Aerospace, High temperature and Military.
The DLCC has been designed and tooled to be able to
meet small, medium and high volume demand allowing
customers to access the technology and grow the
requirements with their product, utilising scalable assembly
techniques to offer high rel diodes, at competitive pricing
structures. This includes full pre cap access for inspection of
semiconductor prior to hermetic encapsulation.
Experience and Innovation in Semiconductor Solutions
Semelab holds approvals for many aerospace semiconductor
devices, and can manufacture in accordance with CECC,
JANTX, ESAlevel 5000 and other major process flows.
Specialists In
Detailed information
The DLCC package design takes full advantage of the proven
high reliability pedigree of the High Temperature Cofired
Ceramic (HTCC) surface mount packaging technology, which
is easily integrated for automated assembly. Semelab has
taken the existing standards for ceramic surface mount
package manufacture and added additional design features
to enhance thermal performance, to present a competitive
alternative for high reliability applications.
• Ceramic surface mount products
• Hermetic metal packaged devices
• Hermetic power modules
Semelab has more than 35 years of history in the
Please let us know your requirements - we can almost
certainly meet them.
manufacture of semiconductor devices for high reliability
applications with tier one suppliers of Worldwide Space,
Military and Aerospace equipment. Our diverse product
range, focused customer response coupled with flexible
batch size processing and screening in accordance with the
most recognised reliability standards offers an attractive and
cost effective solution for new and existing designs.
• Standard and custom products
• Screening and qualifications
• Continued supply of earlier device types and packages
Diode Leadless Chip Carrier - DLCC
Your Semelab Distributor:
The DLCC family of Ceramic Leadless Chip Carrier packages
The physical dimensions for the DLCC ceramic packages are
designed to fully utilise the recommended solder footprint
for the popular MELF packages, and as such present a drop
in replacement for existing board design. Thermal vias
improve the heat transfer to the solder pads reducing the
diode junction temperature and increasing operating
lifetime; options are also available to allow the lid to be
connected to the Anode or Cathode. Connecting the metal
lid to a known electrical potential stops deep dielectric
discharge in space applications; see the Space Weather link
www.semelab.co.uk/mil/DLCC on the Semelab web site.
DSCC
Qualified
Manufacturers
List
Defence
Supply
Center
European
Space Agency
MOD
Registration
Members of the
Component
Obsolescence
Group
Columbus
ISO 9001
FM36235
M/0103/CECC/UK
BS 9000
1360/M
VQC-03-003050
VQC-03-003049
Cage
Code U3158
Qualification 253
2M8S02
Semelab Limited
Coventry Road,
Lutterworth,
Tel: +44 (0) 1455 556565
Fax: +44 (0) 1455 552612
Email: sales@semelab-tt.com
Leicestershire. LE17 4JB
UK
Web: www.semelab-tt.com
A subsidiary of TT electronics plc.
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Issue No. A-10