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1987294-2 PDF预览

1987294-2

更新时间: 2022-04-27 23:14:52
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
44页 3150K
描述
Connectivity Systems for PV Manufacturers

1987294-2 数据手册

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SOLARLOK Connectivity Systems for PV Manufacturers  
Mechanical, Environmental and Electrical Testing Capabilities  
Force-deflection curves are generated to verify that  
spring contact properties meet design criteria.  
Contact resistance and temperature rise are measured  
and recorded automatically. These parameters help to  
establish/verify current carrying capacity, and de-rating  
curves. Test samples are isolated to minimize the  
influence of external variables such as air movement.  
Components/assemblies are exposed to cold, heat,  
moisture, and temperature change. Thermal shock  
is accomplished with the 2-chamber method.  
Environmental chambers operate from -70°C to +180°C  
enabling simulation of real-world conditions.  
Slow-motion bending and vibration testing simulates  
line movements in the wire, stressing the crimped  
termination. Industrial atmospheres are generated  
with a gas mixture of SO2, H2S, NO2 and Cl2.  
3D X-ray computer tomography provides high  
resolution three-dimensional non-destructive  
analysis capability.  
Dimensions are in inches and millimeters unless otherwise specified.  
Values in brackets are standard equivalents. Dimensions are shown  
for reference purposes only. Specifications subject to change.  
USA: 1-800-522-6752  
Canada: +1-905-475-6222  
Mexico: +52 (0) 55-1106-0800  
Latin/S. America: +54 (0) 11-4733-2200  
Germany: +49 (0) 6251-133-1999  
UK: +44 (0) 800-267666  
France: +33 (0) 1-3420-8686  
Netherlands: +31 (0) 73-6246-999  
China: +86 (0) 400-820-6015  
te.com/solar  
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Catalog 3-1773458-7 | Issue Date 04/2011  

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