Datasheet > 1812L260/12MR

1812L260/12MR

更新时间： 2024-01-23 23:35:13

品牌	Logo	应用领域
力特 - LITTELFUSE		过载保护电阻器
页数	文件大小	规格书
7页	936K
描述
PTC Resettable Fuse, Surface Mount, CHIP, 1812, HALOGEN FREE AND ROHS COMPLIANT

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数据手册

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1812L260/12MR 技术参数

是否Rohs认证：	符合	生命周期：	Active
包装说明：	,	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8533.40.80.70
风险等级：	1.56	其他特性：	RESISTANCE MIN IS 0.015 OHMS
JESD-609代码：	e3	安装特点：	SURFACE MOUNT
端子数量：	2	最高工作温度：	85 °C
最低工作温度：	-40 °C	封装形状：	RECTANGULAR PACKAGE
包装方法：	TR, 7 INCH	电阻器类型：	PTC RESETTABLE FUSE
子类别：	Non-linear Resistors	表面贴装：	YES
端子面层：	Matte Tin (Sn)	端子位置：	DUAL ENDED
端子形状：	ONE SURFACE	热敏电阻器应用：	OVERLOAD PROTECTION
Base Number Matches：	1

1812L260/12MR 数据手册

POLY-FUSE Resettable PTCs

Surface Mount > 1812L Series

Temperature Rerating Curve

Physical Speciﬁcations

Solder-Plated Copper (Solder Material:

MatteTin (Sn))

Terminal Material

Lead Solderability

170%

150%

130%

Meets EIA Speciﬁcation RS186-9E, ANSI/

J-STD-002 Category 3.

110%

90%

70%

Environmental Speciﬁcations

Operating/StorageTemp.

-40°C to +85°C

Max. Device SurfaceTemp.

inTripped State

125°C

50%

30%

10%

+85°C, 1000 hours

-/+5% typical resistance change

Passive Aging

+85°C, 85% R.H.,1000 hours

-/+5% typical resistance change

-40 -30 -20 -10

20 30

Temperature (°C)

40 50 60 70 80 85

Humidity Aging

MIL–STD–202, Method 107

+85°C/-40°C 20 times

-30% typical resistance change

Thermal Shock

Note:

TypicalTemperature rerating curve, refer to table for derating data

MIL–STD–202, Method 215,

No change

Solvent Resistance

MIL–STD–883, Method 2007,

Condition A, No change

Vibration

Moisture Level Sesitivity

Level 1, J–STD–020

Soldering Parameters

Proﬁle Feature

Pb-Free Assembly

Critical Zone

Average Ramp-Up Rate (T_S(max)to T_P)

Temperature Min (T_s(min)

3°C/second max

to t

Ramp-up

)

150°C

S(max)

Temperature Max (T_s(max)

Time (Min to Max) (t_s)

Temperature (T_L)

)

Pre Heat:

200°C

Ramp-down

60 – 180 secs

217°C

Preheat

Time Maintained

Above:

S(min)

Temperature (t_L)

60 – 150 seconds

260^+0/-5°C

Peak / ClassiﬁcationTemperature (T_P)

time to peak temperature

Time within 5°C of actual peak

Temperature (t_p)

Time

20 – 40 seconds

Ramp-down Rate

6°C/second max

8 minutes Max.

-- All temperature refer to topside of the package, measured on the package body surface

-- If reﬂow temperature exceeds the recommended proﬁle, devices may not meet the

performance requirements

Time 25°C to peakTemperature (T_P)

-- Recommended reﬂow methods: IR, vapor phase oven, hot air oven, N₂environment

for lead

-- Recommended maximum paste thickness is 0.25mm (0.010inch)

-- Devices can be cleaned using standard industry methods and solvents

-- Devices can be reworked using the standard industry practices

Speciﬁcations are subject to change without notice.

Revised: 07/21/17

1 234 5 6 7

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