Datasheet > 1812L07533

1812L07533

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
力特 - LITTELFUSE		/
页数	文件大小	规格书
6页	416K
描述
POLYFUSE㈢ Resettable PTCs Surface Mount

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1812L07533 数据手册

POLYFUSE^®Resettable PTCs

Surface Mount

Soldering Parameters

Condition

Reﬂow

Peak Temp/ Duration Time

Time above liquids (TAL) 220°C

Preheat 120°C~ 180°C

Storage Condition

260°C / 10 Sec

Soldering

Cooling

260

220

60 Sec ~ 100 Sec

50 Sec ~ 150 Sec

0°C~35°C, 70%RH

Preheating

180

120

• Recommended reﬂow methods: IR, vapor phase oven, hot air

oven, N₂environment for lead-free

• Devices are not designed to be wave soldered to the bottom side

of the board.

• Recommended maximum paste thickness is 0.25mm (0.010 inch)

60 to 100

120

50 to 150

• Devices can be cleaned using standard industry methods and

solvents.

Time(s)

Note: If reﬂow temperatures exceed the recommended proﬁle,

devices may not meet the performance requirements.

Physical Speciﬁcations

Environmental Speciﬁcations

Operating/Storage

Solder-Plated Copper (Solder Material:

Terminal Material

-40°C to +85°C

Matte Tin (Sn))

Temperature

Meets EIA Speciﬁcation RS186-9E, ANSI/

Lead Solderability

Maximum Device Surface

Temperature in Tripped State

125°C

J-STD-002 Category 3.

+85°C, 1000 hours

Passive Aging

5% typical resistance change

+85°C, 85%R.H. 1000 hours

5% typical resistance change

Humidity Aging

MIL-STD-202 Method 107G

+85°C/-40°C 20 times

-30% typical resistance change

Thermal Shock

Solvent Resistance

Vibration

MIL-STD-202, Method 215

No change

MIL-STD-883C, Method 2007.1,

Condition A

No change

ꢁ

1812L Series

www.littelfuse.com

Electronics Designers Guide

Speciﬁcations are subject to change without notice.

1 2 345 6

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