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16M0DS PDF预览

16M0DS

更新时间: 2024-11-27 22:09:11
品牌 Logo 应用领域
美高森美 - MICROSEMI 整流二极管
页数 文件大小 规格书
1页 22K
描述
60V 300mA MONOLITHIC DIODE ARRAY

16M0DS 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Obsolete零件包装代码:DIE
包装说明:R-XUUC-N11针数:1
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.40风险等级:5.92
Is Samacsys:N配置:COMPLEX
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
JESD-30 代码:R-XUUC-N11JESD-609代码:e0
元件数量:16端子数量:11
最大输出电流:0.3 A封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:UNCASED CHIP
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
最大反向恢复时间:0.02 µs表面贴装:YES
端子面层:TIN LEAD端子形式:NO LEAD
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

16M0DS 数据手册

  
16M0  
Phone: 617-924-9280  
Fax: 617-924-1235  
A Microsemi Company  
580 Pleasant St.  
Watertown, MA 02472  
DIE SPECIFICATION  
60V 300mA  
MONOLITHIC DIODE ARRAY  
FEATURES:  
·
·
·
·
16 DIODE CORE DRIVER  
trr < 20 ns  
.054"  
RUGGED AIR-ISOLATED CONSTRUCTION  
LOW REVERSE LEAKAGE CURRENT  
J
J
J
J
Absolute Maximum Ratings:  
A
C
.060"  
Symbol  
Parameter  
Limit  
Unit  
A
VBR(R) *1 *2 Reverse Breakdown Voltage  
60  
Vdc  
J
J
J
J
IO  
*1  
Continuous Forward Current  
*1 Peak Surge Current (tp= 1/120 s)  
Operating Junction Temperature Range  
Storage Temperature Range  
300  
500  
-65 to +150 °C  
-65 to +200 °C  
mAdc  
mAdc  
IFSM  
Top  
Tstg  
NOTE 1: Each Diode  
NOTE 2: Pulsed: PW = 100ms max.; duty cycle < 20%  
Electrical Characteristics (Per Diode) @ 25°C unless otherwise specified  
Symbol Parameter  
Conditions  
Min  
Max Unit  
BV1  
Vf1  
Vf2  
IR1  
Ct  
Breakdown Voltage  
Forward Voltage  
Forward Voltage  
Reverse Current  
Capacitance (pin to pin)  
Forward Recovery Time IF = 500mAdc  
IR = 10uAdc  
60  
IF = 100mAdc *1  
IF = 500mAdc *1  
VR = 40 Vdc  
1
Vdc  
1.5 Vdc  
0.1 uAdc  
8.0 pF  
40 ns  
VR = 0 Vdc; f = 1 MHz  
tfr  
trr  
Reverse Recovery Time IF = IR = 200mAdc, irr = 20 mAdc, RL = 100 ohms  
20 ns  
NOTE 1: Pulsed: PW = 300us +/- 50us, duty cycle < 2%, 90us after leading edge  
Packaging Options:  
Processing Options:  
W: Wafer (100% probed) U: Wafer (sample probed)  
Standard: Capable of JANTXV application (No Suffix)  
Suffix C: Commercial  
D: Chip (Waffle Pack)  
B: Chip (Vial)  
V: Chip (Waffle Pack, 100% visually inspected) X: Other  
Suffix S: Capable of S-Level equivalent applications  
ORDERING INFORMATION  
Metallization Options:  
PART #: 16M0_ _- _  
First Suffix Letter: Packaging Option  
Second Suffix Letter: Processing Option  
Dash #: Metallization Option  
Standard: Al Top  
/ Au Backside (No Dash #)  
Sertech reserves the right to make changes to any product design, specification or other information at any time without prior  
notice.  
MSC1024.PDF Rev - 12/3/98  

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