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146 CTI

更新时间: 2023-12-06 19:44:48
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
11页 137K
描述
Aluminum Electrolytic Capacitors SMD (Chip), High Temperature, Low Impedance

146 CTI 数据手册

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146 CTI  
Vishay BCcomponents  
www.vishay.com  
MOUNTING  
SOLDERING  
The capacitors are designed for automatic placement on to  
printed-circuit boards.  
Soldering conditions are defined by the curve, temperature  
versus time, where the temperature is that measured on the  
component during processing.  
Optimum dimensions of soldering pads depend amongst  
others on soldering method, mounting accuracy, print  
layout and / or adjacent components.  
For maximum conditions refer to Fig. 4.  
Any temperature versus time curve which does not exceed  
the specified maximum curves may be applied.  
For recommended soldering pad dimensions, refer to Fig. 3  
and Table 3.  
As a general principle, temperature and duration shall be the  
minimum necessary required to ensure good soldering  
connections. However, the specified maximum curves  
should never be exceeded.  
e
a
c
a
d
f
b
b
b
d
a
c
a
a
c
a
Case size Ø D 10 mm  
Case size Ø D = 12.5 mm  
Case size Ø D 16 mm  
Fig. 3 - Recommended soldering pad dimensions  
Table 3  
RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters  
CASE CODE  
a
b
c
d
-
e
-
f
-
-
-
0810  
4.4  
4.4  
4.4  
6.3  
6.3  
7.8  
7.8  
8.8  
8.8  
2.5  
2.5  
2.5  
2.5  
2.5  
9.6  
9.6  
9.6  
9.6  
3.0  
4.0  
4.0  
4.0  
4.0  
4.7  
4.7  
4.7  
4.7  
1010  
-
-
1012  
-
-
1213  
4.2  
4.2  
-
5.0  
5.6  
1216  
5.0  
5.6  
1616  
-
-
-
-
-
-
-
-
1621  
-
1816  
-
1821  
-
Revision: 05-Dec-16  
Document Number: 28403  
4
For technical questions, contact: aluminumcaps1@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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