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11-21SYGC/S530-E1/TR8 PDF预览

11-21SYGC/S530-E1/TR8

更新时间: 2024-01-17 12:51:32
品牌 Logo 应用领域
亿光 - EVERLIGHT 可见光LED光电
页数 文件大小 规格书
9页 167K
描述
Technical Data Sheet 1206 Package Chip LED with Inner lens

11-21SYGC/S530-E1/TR8 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:ROHS COMPLIANT, SMD, 2 PIN
Reach Compliance Code:compliantHTS代码:8541.40.20.00
Factory Lead Time:11 weeks风险等级:1.7
Is Samacsys:N颜色:BRILLIANT YELLOW GREEN
配置:SINGLE最大正向电流:0.025 A
JESD-609代码:e4透镜类型:WATER CLEAR
标称发光强度:29.0 mcd安装特点:SURFACE MOUNT
功能数量:1端子数量:2
最高工作温度:85 °C最低工作温度:-40 °C
光电设备类型:SINGLE COLOR LED总高度:1.5 mm
包装方法:TAPE AND REEL 7"峰值波长:575 nm
形状:ROUND尺寸:1.1 mm
表面贴装:YES端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子节距:3.1 mm视角:60 deg
Base Number Matches:1

11-21SYGC/S530-E1/TR8 数据手册

 浏览型号11-21SYGC/S530-E1/TR8的Datasheet PDF文件第3页浏览型号11-21SYGC/S530-E1/TR8的Datasheet PDF文件第4页浏览型号11-21SYGC/S530-E1/TR8的Datasheet PDF文件第5页浏览型号11-21SYGC/S530-E1/TR8的Datasheet PDF文件第6页浏览型号11-21SYGC/S530-E1/TR8的Datasheet PDF文件第7页浏览型号11-21SYGC/S530-E1/TR8的Datasheet PDF文件第9页 
EVERLIGHT ELECTRONICS CO.,LTD.  
11-21SYGC/S530-XX/TR8  
Precautions For Use  
1. Over-current-proof  
Customer must apply resistors for protection , otherwise slight voltage shift will cause big  
current change ( Burn out will happen ).  
2. Storage  
2.1 Do not open moisture proof bag before the products are ready to use.  
2.2 Before opening the package, the LEDs should be kept at 30or less and 90%RH or less.  
2.3 The LEDs should be used within a year.(To fit the MSL-2 .)  
2.4 After opening the package, the LEDs should be kept at 30or less and 70%RH or less.  
2.5 The LEDs should be used within 168 hours (7 days) after opening the package.  
2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the  
storage time, baking treatment should be performed using the following conditions.  
Baking treatment : 60±5for 24 hours.  
3. Soldering Condition  
3.1 Pb-free solder temperature profile  
3.2 Reflow soldering should not be done more than two times.  
3.3 When soldering, do not put stress on the LEDs during heating.  
3.4 After soldering, do not warp the circuit board.  
Everlight Electronics Co., Ltd.  
Device No:SZDSE-111-006  
http://www.everlight.com  
Prepared date: 11-Jul-2005  
Rev. 1  
Page: 8 of 9  
Prepared by: Wu xiaowei  

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