10ETF..S QUIETIR Series
I2140 rev. A 12/99
Thermal-Mechanical Specifications
Parameters
10ETF..S Units
Conditions
TJ
Max.JunctionTemperatureRange
-40to150
-40to150
1.5
°C
°C
Tstg Max.StorageTemperatureRange
RthJC Max.ThermalResistanceJunction
toCase
°C/W
DCoperation
RthJA Max.ThermalResistanceJunction
toAmbient(PCBMount)**
40
°C/W
Ts
wt
SolderingTemperature
ApproximateWeight
240
°C
2(0.07)
g(oz.)
CaseStyle
D2Pak(SMD-220)
**Whenmountedon1"square(650mm2)PCBofFR-4orG-10material4oz(140µm)copper40°C/W
Forrecommendedfootprintandsolderingtechniquesrefertoapplicationnote#AN-994
150
145
140
135
130
125
120
1 50
1 45
1 40
1 35
1 30
1 25
1 20
10ET F..S S er ies
10 ET F..S S eries
(D C ) = 1.5 ° C /W
R
(D C ) = 1 .5 °C /W
R
thJC
thJC
Condu ction Angle
Condu ction Period
30°
30°
60°
60°
90°
90°
120°
180°
120°
180°
D C
14
0
2
4
6
8
10
12
16
0
2
4
6
8
10
12
Av era g e Fo rw a rd C u rre n t (A )
A ve ra g e For w a rd C u rren t (A)
Fig.1-CurrentRatingCharacteristics
Fig.2-CurrentRatingCharacteristics
1 6
20
16
12
8
D C
180°
120°
90°
60°
30°
180°
120°
90°
60°
30°
1 4
1 2
1 0
8
R M S Lim it
RM S Limit
6
C onduction Angle
1 0ETF ..S S eries
Condu ction Period
1 0ET F..S Serie s
4
4
0
2
T
=
150 °C
T
=
150 °C
J
J
0
0
2
4
6
8
10
0
4
8
12
16
A ve ra g e Fo rw a rd C u rren t (A)
A ve ra g e Fo rw a rd C u rren t ( A)
Fig.3-ForwardPowerLossCharacteristics
Fig.4-ForwardPowerLossCharacteristics
3
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