Datasheet > 105142-7000

105142-7000

更新时间： 2024-02-12 01:54:18

品牌	Logo	应用领域
莫仕 - MOLEX		/
页数	文件大小	规格书
3页	1073K
描述
IC Socket

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技术参数
数据手册

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105142-7000 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Obsolete	Reach Compliance Code：	unknown
ECCN代码：	EAR99	HTS代码：	8536.69.40.40
Factory Lead Time：	21 weeks	风险等级：	8.59
联系完成配合：	NOT SPECIFIED	触点材料：	COPPER ALLOY
设备插槽类型：	IC SOCKET	Base Number Matches：	1

105142-7000 数据手册

LGA 2011-0 Server

CPU Socket

Speciﬁcations

Reference Information

Packaging:

JEDEC Hard Tray (Sockets only)

UL File No.: E29179

CSA File No.: NA

Dielectric Withstanding Voltage:

360V (RMS)

Insulation Resistance:

800 Megaohms min.

ILM Cover (Optional): PC/ABS

Pan and Shoulder Screws:

Nickel-plated Low Carbon Steel

Housing and Cap:

High Temperature Thermoplastic,

Black

Use With:

Mechanical

Intel*’s Core i7-3930K, Core i7-

3820 and Core i7-3960K Extreme

Edition processors

Contact:

Contact Insertion Force:

Zero Insertion Force (ZIF)

Durability (min.): 30 cycles

High Strength Copper (Cu) Alloy

Flammability: UL-94V-0

Plating (Socket):

Designed In: mm

RoHS: Yes

Halogen Free: Yes

Glow Wire Compliant: No

Contact Area — 0.38 or 0.76μm

(15 or 30μ”) Gold (Au) Plating

Solder Ball Area — Lead-free

solder ball SnAg3.0Cu0.5

Contact and Paddle Area —

1.27μm (50μ”) min. Nickel

Recommended PCB Thickness:

1.60mm (.062”)/2.54mm (.100”)

Operating Temperature:

-40 to +100°C

Physical

ILM Active and Hinge Lever:

Stainless Steel

ILM Frame:

Stainless Steel with Nickel (Ni)

Plating

ILM Base (or Load) Plate:

Stainless Steel

ILM Frame Insulator:

Polypropylene Sheet

Electrical

Current (max.): 0.5A

Voltage (max): 5.0V

Contact Resistance (EOL):

22 milliohms max. socket average

Additional Product Features

4 shoulder nuts (blue arrows) of both the Standard and Narrow ILM are secured into corresponding 4 male threaded

studs (black arrows) of the backplate

4 heatsink studs (red circles) are used for mounting of heatsink above socket assembly

Heatsink studs

Male threaded studs

Shoulder nuts

LGA 2011-0 Standard ILM Assembly in

‘closed’ position (105142-8000)

LGA 2011-0 Backplate Assembly

(105142-7000)

LGA 2011-0 Narrow ILM Assembly in

‘closed’ position (105142-9000)

Mounting features of the LGA 2011 Socket ILM frame and baseplate

‘Closed’ lock sign.

Users should

always close the

ILM from this side

ﬁrst

‘Open’ lock sign.

Users should

always open the

ILM from this side

ﬁrst

‘Open’ and ’closed’ indicators on the LGA 2011-0 Socket ILM frame

* Intel, LGA 2011-0, Socket R, ILM, Core™ i-series (Core i7) and relevant names are either trademarks or registered trademarks of

Intel Corporation

^†Thermal Design Power (TDP): The target power level the thermal solution is designed to dissipate. TDP is not the maximum

power that the processor can dissipate.

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