LGA 2011-0 Server
CPU Socket
Approved by Intel and supporting its top-of-the-line
Core i7 series processors, the compact LGA 2011-0 CPU
socket provides the electrical, thermal and mechanical
reliability servers, workstations and high-end PCs need
to achieve target processor performance levels
105142 LGA 2011-0 Server
CPU Socket
Augmenting Molex’s CPU socket solutions and replacing the LGA 1366,
the Intel-approved LGA 2011-0 socket (Socket R) offers the electrical,
mechanical and thermal reliability enterprise servers, workstations and
high-end PCs need to reach target performance levels of Intel’s Core* i7
series of 32nm-Sandy Bridge-E microprocessors.
Molex’s LGA 2011-0 socket features a fully loaded Interstitial Seating Plane
(ISP) design for improved contact reliability by preventing circuit opens
and shorts caused by contact deformation during a package overload. The
socket uses high strength, copper alloy contacts for robust performance.
The socket terminals are oriented at angles that reduce the risk of cross-
contact during processor overloads (‘over compression’). Compared with
the LGA 1366 socket, the increase in the LGA 2011-0’s contact density of
12% while maintaining the 1.016mm via-pitch requirement would mean
greater space-savings since a corresponding square pitch array requires a
0.9652mm via-pitch for the same package size!
The use of high-temperature housing material ensures socket integrity
under reflow conditions. Standoffs at the bottom of the socket base help
establish minimum socket height after solder reflow.
The LGA 2011-0 socket assembly retains its 3-piece socket, ILM and
backplate configuration for improved solder-joint reliability. It uses a larger
backplate than the LGA 1366 or LGA 1156 sockets and is not backward
compatible for use with any other processors and their ILM assemblies. The
LGA 2011-0 socket is used with two IILM designs – a Standard (Square) and
a Narrow ILM assembly.
LGA 2011-0 CPU Socket with Standard
Independent Loading Mechanism (ILM)
and (optional) ILM cover
The Standard ILM assembly comprises an ILM-top assembly made up of an
ILM frame, a backplate, a hinge lever, load lever with load cam; 4 captive
fasteners and a removable (optional) ILM cover. A removable ILM cover
prevents damage to socket contacts caused by mishandling of processor
during loading and removal (via soldering) of the CPU for either trouble-
shooting or repair.
The Standard ILM has a larger (80 by 80mm) keep-out zone than that (56
by 94mm) of the Narrow ILM. Although both assemblies contain the same
set of components and are assembled in the same way, the position of their
threaded heatsink mounting studs and the design of their ILM levers are
noticeably different.
Molex offers 15 or 30 micron gold (Au)-plated contact sockets which
come with pick-and-place covers for easy placement in automated board
assembly. All sockets are shipped in JEDEC-type hard trays.
LGA 2011-0 socket with pick-and-place
cover
For additional information visit our website at:
www.molex.com/link/lga2011.html.
Features and Benefits
Satisfies requirements of “Intel Core i7 Processor
Family for the LGA2011-0 Socket Thermal / Mechanical
Specification and Design Guide
Supports 130W TDP and target performance
requirements of Intel’s Core i7-3930K, Core i7-3820
and Core i7-3960K Extreme Edition processors
Fully loaded Interstitial Seating Plane (ISP) socket
design
Prevents contact shorting or opens cause by
processor overload
Square or Narrow Independent Loading Mechanism
(ILM) assembly options
Suit different PCB designs with varying ILM outline
dimensions
Dual actuation-levers [U-shaped hinge lever and
V-shaped (CPU) load lever with load cam]
Ensure planarity of seated processor for reliable
electrical contact
Triangle-pin-1 identification on housing, load plate,
alignment walls and orientation posts
For true positioning and snug fit of CPU on socket
before loading
* Intel, LGA 2011-0, LGA 1366, Sandy Bridge-E, Socket R, ILM, Core™ i-series (Core i7) and relevant names are either trademarks
or registered trademarks of Intel Corporation
† Thermal Design Power (TDP): The target power level the thermal solution is designed to dissipate. TDP is not the maximum
power that the processor can dissipate.
5秒后页面跳转
AO3401场效应管参数、引脚图、应用原理图
BT131可控硅参数及引脚图、工作原理详解
74LS32芯片参数、引脚图及功能真值表
全球首块英伟达H200交付 黄仁勋“送货上门”
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
技术参数
数据手册
如果您发现信息不准确，
