GENERAL MLCC
* 波峰焊接
(Wave soldering)
Pb-Sn 焊接
Pb-Sn soldering
无铅焊接
Lead-free soldering
尖峰温度
Peak temperature
230℃~260℃
240℃~270℃
在预热时,请将焊接温度与芯片表面温度之间的温差维持在 T≤150℃。
While in preheating,please keep the temperature difference between soldering temperature and surface temperature of chips as:
T≤150℃.
* 手工焊接
Hand soldering
温度 Temperature
(℃)
350
250
200
150
100
50
Over 1 minute
Gradual
cooling
3s max.
条件 Conditions:
烙铁头温度
Temperature of
soldering iron
head
烙铁功率
烙铁头直径
Diameter of
soldering iron
head
焊接时间
Soldering
time
锡膏量
Solder paste
amount
预热
Preheating
限制条件
Restricted conditions
Power of
soldering
iron
最高 350℃
Highest
temperature:35
0℃
最大 20W
20W at the
highest
请勿使用烙铁头直接接触陶瓷元件
Please avoid the derect contact
between soldering iron head and
ceramic components
建议 1mm
1mm
recommended
最长 3s
3s at the
longest
≤1/2 芯片厚度
≤1/2 chip
thickness
△≤130℃
*以最新版本的内容为准