Datasheet > 08055C103K-MR

08055C103K-MR

更新时间： 2022-01-19 02:16:00

品牌	Logo	应用领域
其他 - ETC		过程控制系统 PCS
页数	文件大小	规格书
12页	326K
描述
CAP. 10NF MINIREEL 500PCS

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08055C103K-MR 数据手册

Surface Mounting Guide

MLC Chip Capacitors

Component Pad Design

Component pads should be designed to achieve good sol-

der filets and minimize component movement during reflow

soldering. Pad designs are given below for the most com-

mon sizes of multilayer ceramic capacitors for both wave

and reflow soldering. The basis of these designs is:

• Pad width equal to component width. It is permissible to

decrease this to as low as 85% of component width but it

is not advisable to go below this.

• Pad overlap 0.5mm beneath component.

• Pad extension 0.5mm beyond components for reflow and

1.0mm for wave soldering.

REFLOW SOLDERING

Case Size

0402

1.70 (0.07)

2.30 (0.09)

3.00 (0.12)

4.00 (0.16)

5.60 (0.22)

6.60 (0.26)

0.60 (0.02)

0.80 (0.03)

1.00 (0.04)

1.00 (0.04))

1.00 (0.04)

0.50 (0.02)

0.70 (0.03)

1.00 (0.04)

2.00 (0.09)

3.60 (0.14)

4.60 (0.18)

0.60 (0.02)

0.80 (0.03)

1.00 (0.04)

0.50 (0.02)

0.75 (0.03)

1.25 (0.05)

1.60 (0.06)

2.50 (0.10)

2.00 (0.08)

3.00 (0.12)

6.35 (0.25)

5.00 (0.20)

6.35 (0.25)

0603

0805

1206

1210

1808

1812

1825

2220

2225

Dimensions in millimeters (inches)

1...3 4 567 8 9...12

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