Thin-Film RF/Microwave Capacitor Technology
Automotive Grade Accu-P® Series
Performance Characteristics RF Power Applications
RF POWER APPLICATIONS
HEAT DISSIPATION
In RF power applications capacitor losses generate heat. Two factors of
particular importance to designers are:
•
Heat is dissipated from a capacitor through a variety of paths, but the
key factor in the removal of heat is the thermal conductivity of the
capacitor material.
•
•
Minimizing the generation of heat.
Dissipating heat as efficiently as possible.
•
•
The higher the thermal conductivity of the capacitor, the more rapidly
heat will be dissipated.
CAPACITOR HEATING
The table below illustrates the importance of thermal conductivity to the
performance of Accu-P® in power applications.
•
The major source of heat generation in a capacitor in RF power
applications is a function of RF current (I) and ESR, from the relationship:
Power dissipation = I2RMS x ESR
Data used in calculating the graph:
•
•
Accu-P® capacitors are specially designed to minimize ESR and therefore
RF heating. Values of ESR for Accu-P® capacitors are significantly less
than those of ceramic MLC components currently available.
Thermal impedance of capacitors:
•
•
•
0402
0603
0805
17°C/W
12°C/W
6.5°C/W
PRODUCT
MATERIAL
Alumina
Magnesium Titanate
THERMAL CONDUCTIVITY W/mK
Accu-P®
18.9
6.0
Microwave MLC
Thermal impedance measured using RF generator, amplifier and strip-line transformer.
Power Handling
Accu-P® 10pF
ESR of capacitors measured on Boonton 34A
THERMAL IMPEDANCE
Thermal impedance of Accu-P® chips is shown below com- pared with the thermal
impedance of Microwave MLC’s.
The thermal impedance expresses the temperature difference in °C between chip center and
termination caused by a power dissipation of 1 watt in the chip. It is expressed in °C/W.
ADVANTAGES OF ACCU-P® IN RF POWER CIRCUITS
The optimized design of Accu-P® offers the designer of RF power circuits the following
advantages:
•
•
•
Reduced power losses due to the inherently low ESR of Accu-P®.
Increased power dissipation due to the high thermal conductivity of Accu-P®.
The only true test of a capacitor in any particular application is its performance under
operating conditions in the actual circuit.
CAPACITOR TYPE
CHIP SIZE
THERMAL IMPEDANCE (°C/W)
0805
1210
6.5
5
Accu-P®
0505
1210
12
7.5
Microwave MLC
PRACTICAL APPLICATION IN RF POWER CIRCUITS
•
There is a wide variety of different experimental methods for measuring the power handling performance of a capacitor in RF power circuits. Each
method has its own problems and few of them exactly reproduce the conditions present in “real” circuit applications.
•
Similarly, there is a very wide range of different circuit appli- cations, all with their unique characteristics and operating conditions which cannot possibly
be covered by such “theoretical” testing.
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
40
TDS-RFM-0041 | Rev 1
rf microwave products
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