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0780610001 PDF预览

0780610001

更新时间: 2024-02-13 20:59:53
品牌 Logo 应用领域
莫仕 - MOLEX /
页数 文件大小 规格书
7页 365K
描述
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38μm (15μ) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins

0780610001 数据手册

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This document was generated on 04/13/2010  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  
Part Number:  
Status:  
0780610001  
Active  
Description:  
1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38µm  
(15µ") Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins, with Off-White  
Latches, 2.67mm (.105") Solder Tail Length, Lead-free  
Documents:  
3D Model  
Drawing (PDF)  
Product Specification PS-78061-001 (PDF)  
RoHS Certificate of Compliance (PDF)  
Series  
image - Reference only  
China RoHS  
Agency Certification  
CSA  
UL  
LR 19980  
E29179  
EU RoHS  
ELV and RoHS  
Compliant  
REACH SVHC  
Contains SVHC: No  
Halogen-Free  
Status  
Not Halogen-Free  
Need more information on product  
environmental compliance?  
General  
Product Family  
Series  
Memory Module Sockets  
78061  
<LI>Latches in Off-White Color <LI>Solder Tail Length  
at 2.67mm (.105")  
Memory Module  
MO-256  
Comments  
Component Type  
JEDEC Outline  
Product Name  
FB DIMM  
Email productcompliance@molex.com  
For a multiple part number RoHS Certificate of  
Compliance, click here  
Physical  
Circuits (Loaded)  
240  
Black, Natural  
Color - Resin  
Durability (mating cycles max)  
Entry Angle  
Flammability  
25  
Please visit the Contact Us section for any  
non-product compliance questions.  
Vertical (Top Entry)  
94V-0  
Keying to Mating Part  
Material - Metal  
Yes  
Brass, Phosphor Bronze  
Material - Plating Mating  
Material - Plating Termination  
Material - Resin  
Gold  
Tin-Lead  
High Temperature Thermoplastic  
Search Parts in this Series  
78061Series  
PC Tail Length (in)  
PC Tail Length (mm)  
PCB Locator  
0.105 In  
2.67 mm  
Yes  
Mates With  
JEDEC MO-256 modules  
PCB Retention  
Yes  
PCB Thickness Recommended (in)  
PCB Thickness Recommended (mm)  
Packaging Type  
0.062 In  
1.60 mm  
Tray  
Pitch - Mating Interface (in)  
Pitch - Mating Interface (mm)  
Plating min: Mating (µin)  
Plating min: Mating (µm)  
Temperature Range - Operating  
Termination Interface: Style  
0.039 In  
1.00 mm  
15  
0.38  
-55°C to +85°C  
Through Hole  
Electrical  
Current - Maximum per Contact  
Voltage - Maximum  
Voltage Key  
1A  
30V  
1.8V, Center  
Solder Process Data  
Duration at Max. Process Temperature (seconds)  
Lead-free Process Capability  
5
SMC & Wave Capable (TH only)  
1
Max. Cycles at Max. Process Temperature  

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