AD532
ORDERING GUIDE
CHIP DIMENSIONS AND BONDING DIAGRAM
Contact factory for latest dimensions.
Temperature
Ranges
Package
Descriptions
Package
Options
Dimensions shown in inches and (mm).
Model
AD532JD
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
–55°C to +125°C
–55°C to +125°C
Side Brazed DIP
Side Brazed DIP
Side Brazed DIP
Side Brazed DIP
Header
Header
Chip
Side Brazed DIP
Side Brazed DIP
Side Brazed DIP
LCC
Header
Header
D-14
D-14
D-14
D-14
H-10A
H-10A
AD532JD/+
AD532KD
AD532KD/+
AD532JH
AD532KH
AD532J Chip
AD532SD
AD532SD/883B
JM38510/13903BCA –55°C to +125°C
AD532SE/883B
AD532SH
AD532SH/883B
D-14
D-14
D-14
E-20A
H-10A
H-10A
H-10A
–55°C to +125°C
–55°C to +125°C
–55°C to +125°C
JM38510/13903BIA –55°C to +125°C
AD532S Chip –55°C to +125°C
Header
Chip
FUNCTIONAL DESCRIPTION
The functional block diagram for the AD532 is shown in Figure
1, and the complete schematic in Figure 2. In the multiplying
and squaring modes, Z is connected to the output to close the
feedback around the output op amp. (In the divide mode, it is
used as an input terminal.)
The X and Y inputs are fed to high impedance differential am-
plifiers featuring low distortion and good common-mode rejec-
tion. The amplifier voltage offsets are actively laser trimmed
to zero during production. The product of the two inputs is
resolved in the multiplier cell using Gilbert’s linearized trans-
conductance technique. The cell is laser trimmed to obtain
VOUT = (X1 – X2)(Y1 – Y2)/10 volts. The built-in op amp is used
to obtain low output impedance and make possible self-contained
operation. The residual output voltage offset can be zeroed at
VOS in critical applications . . . otherwise the VOS pin should be
grounded.
Figure 1. Functional Block Diagram
Figure 2. Schematic Diagram
–3–
REV. B