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0453391601

更新时间： 2024-02-07 23:09:50
品牌 Logo 应用领域
莫仕 - MOLEX 连接器电信连接器和数据通信连接器
页数 文件大小 规格书
26页 916K
描述
0.8MM HANDYLINK PLUG CONNECTOR MODULES FOR WIRE TERMINATION

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0453391601 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Obsolete包装说明：ROHS COMPLIANT
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8536.69.40.30Factory Lead Time：25 weeks 5 days
风险等级：5.84Is Samacsys：N
主体/外壳类型：PLUG连接器类型：TELECOM AND DATACOM CONNECTOR
联系完成配合：NOT SPECIFIED触点性别：MALE
触点材料：NOT SPECIFIEDDIN 符合性：NO
空壳：NO滤波功能：NO
IEC 符合性：NOMIL 符合性：NO
插接信息：MULTIPLE MATING PARTS AVAILABLE混合触点：NO
安装方式：STRAIGHT安装类型：BOARD
选件：GENERAL PURPOSE外壳材料：POLYETHYLENE
端接类型：SOLDER触点总数：16
UL 易燃性代码：94V-0Base Number Matches：1

0453391601 数据手册

 浏览型号0453391601的Datasheet PDF文件第4页浏览型号0453391601的Datasheet PDF文件第5页浏览型号0453391601的Datasheet PDF文件第6页浏览型号0453391601的Datasheet PDF文件第8页浏览型号0453391601的Datasheet PDF文件第9页浏览型号0453391601的Datasheet PDF文件第10页 
HANDYLINK™  
APPLICATION SPECIFICATION  
4.3  
Clearances Between Mated Parts  
The HandyLink connectors are designed such that the corresponding ‘front’ faces fully engage and then spring back 0.20mm to the  
final mated condition. This ‘over-travel clearance’ assures that the components of the passive latching system engage. Please see  
Section 6.4 Design Best Practices for further detailed information.  
5.0 SOLDERING PROCESS RECOMMENDATIONS  
5.144828 SMT Receptacle Connector  
5.1.1 PCB Layout  
See the applicable Sales Drawing for an illustration of the recommended PCB layout. Contact Molex if further assistance is required.  
5.1.2 Solder Paste Stencil Layout  
See Sales Drawing for solderable surfaces. Contact Molex if further assistance is required.  
5.1.3 Reflow Profile  
While the production solder reflow profile is typically established by the customer, based on their specific application, generic reflow  
profiles can be found in Product Specification PS-44828-001. The profiles are provided for reference purposes only.  
5.1.4 Inspection  
Solder joints should be inspected using established conventional methods.  
5.2 45560 SMT Cradle Connector  
5.2.1 PCB Layout  
See the applicable Sales Drawings for illustrations of the recommended PCB pad layouts. Contact Molex if further assistance is  
required.  
5.2.2 Solder Paste Stencil Layout  
See Sales Drawing for recommended PCB pad layout and solder paste thickness.  
REVISION:  
ECR/ECN INFORMATION:  
TITLE:  
SHEET No.  
APPLICATION SPECIFICATION  
HANDYLINK™I/O CONNECTOR SYSTEM  
EC No:  
UCP2006- 1391  
2005/12/13  
7 of 26  
A
DATE:  
DOCUMENT NUMBER:  
CREATED / REVISED BY:  
M. Simmel  
CHECKED BY:  
APPROVED BY:  
Marc Simmel  
Joe Comerci  
SD-45339-001  
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC  
1...45678910...26

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0453391602 MOLEX 0.8MM HANDYLINK PLUG CONNECTOR MODULES FOR WIRE TERMINATION

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0453391602_18 MOLEX 0.80mm Pitch HandyLink Plug for Wire Termination, 16 Circuit (pins 2,3,4,5,6,7,8,15 voided

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0453391603 MOLEX 0.8MM HANDYLINK PLUG CONNECTOR MODULES FOR WIRE TERMINATION

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0453391603_18 MOLEX 0.80mm Pitch HandyLink Plug for Wire Termination, 16 Circuit (pins 2,3,4,5,6,7,15 voided)

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0453391604 MOLEX 0.8MM HANDYLINK PLUG CONNECTOR MODULES FOR WIRE TERMINATION

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0453391604_18 MOLEX 0.80mm Pitch HandyLink Plug for Wire Termination, 16 Circuit (pins 7,10,11,14,15,16 voided

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