MLCC WITH FLEXITERM
项目
技术规格
测 试 方 法
Item
Technical Specification
Test Method and Remarks
将电容在 80~120℃的温度下预热 10~30 秒.
Preheating conditions:80 to 120℃; 10~30s.
上锡率应大于 95%
无铅焊料:
有铅焊料:(Sn/Pb:63/37)
浸锡温度: 235±5℃
外观:无可见损伤.
At least 95% of the terminal electrode is covered by new
solder.
可焊性
浸锡温度: 245±5℃
Solderability
浸锡时间: 2±0.5s
Solder Temperature:
245±5℃
浸锡时间: 2±0.5s
Solder Temperature: 235±5℃
Duration: 2±0.5s
Visual Appearance: No visible damage.
Duration: 2±0.5s
将电容在 100~200℃的温度下预热 10±2 分钟.
浸锡温度: 265±5℃
-5~+10%
ΔC/C
浸锡时间: 10±1s
同初始标准
DF
然后取出溶剂清洗干净,在 10 倍以上的显微镜底下观察.
放置时间:24±2 小时 放置条件:室温
Preheating conditions: 100 to 200℃; 10±2min.
Solder Temperature: 265±5℃
Same to initial value.
同初始标准
Same to initial value.
外观:无可见损伤 上锡率:≥95%
耐焊接热
Resistance to
Soldering
Heat
IR
Duration: 10±1s
Clean the capacitor with solvent and examine it with a
10X(min.) microscope.
Appearance : No visible damage.At least 95% of the
terminal electrode is covered by new solder.
Recovery Time: 24±2h
Recovery condition: Room temperature
试验基板:Al2O3 或 PCB
施压速度:1mm/sec.
弯曲深度:1mm
单位:mm
应在弯曲状态下进行测量。
Test Board: Al2O3 or PCB
Speed: 1mm/sec.
The measurement should be made with the board in
Warp: 1mm
Unit: mm
抗弯曲强度
Resistance to
Flexure of
Substrate
外观:无可见损伤.
Appearance: No visible damage.
the bending position.
(Bending
Strength)
ΔC/C
≤±10%
端头结合强度
Termination
Adhesion
外观无可见损伤
No visible damage.
施加的力:5N
Applied Force: 5N
时间:10±1S
Duration: 10±1S
预处理※(2 类):上限类别温度,1 小时 恢复:24±1h
Preheating conditions: up-category temperature, 1h
Recovery time: 24±1h
初始测量 Initial Measurement
循环次数:5 次,一个循环分以下 4 步:
ΔC/C
-10%~+10%
同初始标准
Same to initial value.
同初始标准
DF
IR
Cycling Times: 5 times, 1 cycle, 4 steps:
Same to initial value.
阶段
温度(Temperature)(℃)
时间(Time)
Step
1
温度循环
Temperature
Cycle
外观:无可见损伤
下限温度(Low- category temp.):
-55
Appearance:No visible damage
30min
2
3
常温(Normal temp.) : +20℃
2~3min
30min
上限温度(Up- category temp.):
+125
4
常温(Normal temp.) : +20℃
2~3min
试验后放置(恢复)时间:24±2h
Recovery time after test: 24±2h