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Diodes Incorporated
ZXTN25100DG
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VCBO
VCEX
VCEO
VECO
VEBO
IC
Value
180
180
100
6
Unit
V
Collector-Base Voltage
Collector-Emitter Voltage (forward blocking)
Collector-Emitter Voltage
V
V
Emitter-Collector Voltage (reverse blocking)
Emitter-Base Voltage
V
7
V
Continuous Collector Current
Base Current
3
A
1
A
IB
Peak Pulse Current
3.5
A
ICM
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
1.2
9.6
1.6
12.8
3
24
5.3
42
Unit
(Note 6)
(Note 7)
(Note 8)
(Note 9)
Power Dissipation
Linear Derating Factor
W
mW/°C
PD
(Note 6)
(Note 7)
(Note 8)
(Note 9)
(Note 10)
104
78
42
23.5
16
Thermal Resistance, Junction to Ambient
RθJA
°C/W
°C
Thermal Resistance, Junction to Lead
RθJL
Operating and Storage Temperature Range
-55 to +150
TJ, TSTG
ESD Ratings (Note 11)
Characteristic
Electrostatic Discharge - Human Body Model
Electrostatic Discharge - Machine Model
Symbol
ESD HBM
ESD MM
Value
4,000
400
Unit
V
V
JEDEC Class
3A
C
Notes:
6. For a device mounted with the collector lead on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still air
conditions whilst operating in steady-state.
7. Same as Note 6, except the device is mounted on 25mm x 25mm 1oz copper.
8. Same as Note 6, except the device is mounted on 50mm x 50mm 2oz copper.
9. Same as Note 8 measured at t<5 seconds.
10. Thermal resistance from junction to solder-point (at the end of the collector lead).
11. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
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May 2015
© Diodes Incorporated
ZXTN25100DG
Document Number DS33705 Rev. 3 - 2