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ZRB18AC80J226ME01# PDF预览

ZRB18AC80J226ME01#

更新时间： 2023-09-03 20:38:08
品牌 Logo 应用领域
村田 - MURATA 医疗医疗器械
页数 文件大小 规格书
27页 1597K
描述
民用设备,工业设备,移动设备,植入式以外的医疗器械设备 [GHTF A/B/C],汽车[信息娱乐 / 舒适设备]

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ZRB18AC80J226ME01# 数据手册

 浏览型号ZRB18AC80J226ME01#的Datasheet PDF文件第1页浏览型号ZRB18AC80J226ME01#的Datasheet PDF文件第2页浏览型号ZRB18AC80J226ME01#的Datasheet PDF文件第4页浏览型号ZRB18AC80J226ME01#的Datasheet PDF文件第5页浏览型号ZRB18AC80J226ME01#的Datasheet PDF文件第6页浏览型号ZRB18AC80J226ME01#的Datasheet PDF文件第7页 
■ Specifications and Test Methods  
No Item  
Specification  
Test Method(Ref. Standard:JIS C 5101, IEC60384）  
No removal of the terminations or other defect should occur.  
Mounting method  
Applied Force  
Solder the capacitor on the test substrate  
5N  
9 Adhesive Strength of  
Termination  
Holding Time  
10+/-1s  
Applied Direction  
In parallel with the test substrate and vertical with the capacitor side  
Appearance  
Capacitance  
Q or D.F.  
No defects or abnormalities.  
Within the specified initial value.  
Within the specified initial value.  
Mounting method  
Kind of Vibration  
Vibration Time  
Solder the capacitor on the test substrate  
A simple harmonic motion 10Hz to 55Hz to 10Hz  
1min  
10 Vibration  
Total amplitude  
1.5mm  
Vibration directions and time  
This motion should be applied for a period of 2hours in each 3 mutually  
perpendicular directions(total of 6hours).  
Appearance  
Capacitance Change  
No defects or abnormalities.  
Within +/-10%  
Mounting method  
Pressurization Method  
Flexure  
Reflow solder the capacitor on the test substrate  
Shown in Fig.2  
1mm  
11 Substrate Bending test  
Holding Time  
5+/-1s  
No defects or abnormalities.  
Test Method  
Preheat  
Kind of Solder  
Test Temperature  
Test Substrate  
Reflow soldering  
150℃ to 180℃、1min  
Sn-3.0Ag-0.5Cu(Lead Free Solder)  
245+/-5℃(peak)、220℃≦(30s to 60s)  
Glass epoxy PCB  
12 Solderability of  
Interposer board  
termination  
Appearance  
Capacitance Change  
Q or D.F.  
I.R.  
Voltage proof  
No defects or abnormalities.  
Within +/-7.5%  
Within the specified initial value.  
Within the specified initial value.  
No defects or abnormalities.  
Pre-treatment  
Heat treatment:Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours  
at room temperature, then measure.  
Reflow soldering  
Sn-3.0Ag-0.5Cu(Lead Free Solder)  
255+/-5℃(peak)、220℃≦(100s)  
150℃ to 160℃  
2 min  
13 Resistance to Soldering  
Heat  
Test Method  
Kind of Solder  
Test Temperature  
Preheat Temperature  
Preheat time  
Post-treatment  
Non treatment:Let sit for 24+/-2hours at room temperature, then measure.  
Appearance  
Capacitance Change  
Q or D.F.  
I.R.  
Voltage proof  
No defects or abnormalities.  
Within +/-7.5%  
Within the specified initial value.  
Within the specified initial value.  
No defects or abnormalities.  
Mounting method  
Pre-treatment  
Solder the capacitor on the test substrate  
Heat treatment:Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours  
at room temperature, then measure.  
5cycles  
14 Temperature Sudden  
Change  
Cycles  
Temperature Cycling  
Post-treatment  
Non treatment:Let sit for 24+/-2hours at room temperature, then measure.  
ZRB18AC80J226ME01-01A  
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