Characteristics
Z01
Figure 3.
On-state rms current versus
ambient temperature (free air
convection full cycle)
Figure 4.
Relative variation of thermal
impedance versus pulse duration
(Z
)
th(j-a)
I
(A)
T(RMS)
K=[Z
1.00
/R ]
th(j-a) th(j-a)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Z01xxA
R
= 60°C/W
th(j-a)
(SOT-223)
Z01xxMUF
Copper surface area
= 5cm²
R
th (j-a) = 100°C/W
(SMBflat-3L)
0.10
Z01xxN
R
= 150°C/W
th(j-a)
(TO-92)
t (s)
p
T
(°C)
amb
0.01
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
0
25
50
75
100
125
Figure 5.
Relative variation of holding
current and latching current versus
junction temperature (typ. values)
Figure 6.
Relative variation of gate trigger
current (I ) and voltage (V
versus junction temperature
)
GT
GT
IGT, VGT[Tj] / IGT, VGT[Tj=25 °C]
I , I [T ] /I , I [T =25°C]
H
L
j
H
L
j
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.5
2.0
1.5
1.0
0.5
0.0
IGT Q1-Q2
IGT Q3
IGT Q4
VGT Q1-Q2-Q3-Q4
IL
IH
T (°C)
j
Tj(°C)
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Figure 7.
Surge peak on-state current versus Figure 8.
number of cycles
Non-repetitive surge peak
on-state current and corresponding
2
value of I t sinusoidal pulse width
ITSM(A)
9
2 2
(A), I t (A s)
I
TSM
100.0
10.0
1.0
8
7
6
5
4
3
T
initial = 25°C
j
T = 20 ms
One cycle
dI/dt limitation:
20A/µs
I
TSM
Non repetitive
Tjinitial = 25 °C
2
2
I
t
Repetitive
Tamb = 95 °C
1
0
t
p
(ms)
Number of cycles
100 1000
0.1
0.01
1
10
0.10
1.00
10.00
4/12
Doc ID 7474 Rev 10