Datasheet > YP102561K050

YP102561K050

更新时间： 2024-04-09 18:56:11

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
16页	3030K
描述
Class II HI-K Class II YP(Y5P), 560pF, +/-10%, 1000Vdc

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YP102561K050 数据手册

Ver: 12

Page: 2 / 16

POE-D04-00-E-12

50V,100V,500V,1KV,2KV Hi-K CERAMIC DISC CAPACITOR FOR DOWN SIZE PRODUCT

Record of change

Date

2008.6.3

2008.8.22

Version

Description

page

1. D15-00-E-09 (before) → POE-D04-00-E-01 (1^stedition)

1. Revised diameter

5-7

16-19

2. Complete lead code

3. Add last SAP code “ H” for halogen and Pb free , epoxy resin..

1.Complete lead code of SAP P/N

2. Page layout adjustment.

2008.12.12

3-7

3. Added marking when the coating resin is Halogen and Pb free Epoxy.

2009.8.5

1. Change PSA & POE logo to Walsin & POE logo.

2011/8/24

5-6

1. Delete the definition about“Old Part No.”

2. Review the diameter dimension code of “Z5U 1KV 332/362” from 060 to be 070.

3. Delete the Part No. of “Z5U 50V/100V 223”.

2011/11/25

2012/11/06

1. Review the item Y5P/Z5U/Z5V

2. Add the Y5U temperature characteristic

1. Revise the temp.(TCC): Y5P(-25℃ to 85℃/ to 125℃) & Cap. Change(±10% / ±35%)

2. Review the OP temp. for Y5P: Y5P : -25℃ ～ +105℃(INCLUDING CAPACITOR’S

SELF-HEATING MAX.+20℃)

7-8

4-15

12-13

2013/5/6

1. Review the Lead diameter φ from 0.60 +/-0.06mm to 0.55+/-0.05mm

2. Review the “DΦ≤6.0mm shall be omitted.” to “ DΦ≤060 shall be omitted.”

3. Review the Solderability temperature from 255(+5/-0)℃ to 245±5℃.,Solderability

6,9

time from 2 ±0.5s to 5±0.5s,

2013/10/18 9

2015/8/4 10

Review the packing specification

1. Review the temperature range:Y5P(-25℃to+105℃)Change（-25℃to+125℃）

2. review the high temperature loading:FOR 1000(+48/-0) HOURS AT 85 ± 2℃

(FOR Y5U, Z5U, Z5V) / AT 105 ± 3℃(ONLY FOR Y5P) AND THEN DRIED FOR

12～24 HOURS AND MEASURED.Change FOR 1000(+48/-0) HOURS AT 85 ± 2℃

(FOR Y5U, Z5U, Z5V) / AT 125 ± 3℃(ONLY FOR Y5P) AND THEN DRIED FOR

12～24 HOURS AND MEASURED.

2015/11/5 11

2019/7/26 12

5-6

7-8

12-13

1. Review the Available lead code of Lead Configuration.

2. Modify the contents of the use of epoxy resin for 1KV products

3. Review the Specification and test method

4. Review 8. Cautions & notices

5. Review 9. Drawing of internal structure and material list

1. Review the Hole-down tape width (W0) from 11.0mm min. to 8.0mm min.

123 4 5 6 7...16

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