Datasheet > XC9140C501MR-G

XC9140C501MR-G

更新时间： 2022-09-29 19:18:30

品牌	Logo	应用领域
特瑞仕 - TOREX		/
页数	文件大小	规格书
32页	2460K
描述
IC REG BST 5V 295MA SYNC SOT-25

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XC9140C501MR-G 数据手册

XC9140 (Design Target)

■PIN CONFIGURATION

XC9140

Series

L_X

V_OUT

1 L_X

GND

V_OUT

V_BAT

CE 4

GND V_BAT

USP-6EL

SOT-25

(BOTTOM VIEW)

(TOP VIEW)

(BOTTOM VIEW)

* The dissipation pad for the USP-6EL package should be solder-plated in recommended mount

pattern and metal masking so as to enhance mounting strength and heat release.

The mount pattern should be connected to GND pin (No.6).

■ PIN ASSIGNMENT

PIN NUMBER

PIN NAME

FUNCTIONS

USP-6EL SOT-25

L_X

V_OUT

V_BAT

Switching

Output Voltage

Power Input

Chip Enable

No Connection

Ground

GND

■ PIN FUNCTION ASSIGNMEN

PIN NAME

SIGNAL

STATUS

Active (All Series)

Stand-by (XC9140A/B Type)

Bypass Mode (XC9140C Type)

* Please do not leave the CE pin open.

■ABSOLUTE MAXIMUM RATINGS

PARAMETER

BAT Pin Voltage

L_XPin Voltage

V_OUTPin Voltage

CE Pin Voltage

L_XPin Current

SYMBOL

V_BAT

V_LX

RATINGS

-0.3 ~ 7.0

-0.3 ~ V_OUT+ 0.3 or 7.0 ^(*1)

UNITS

V_OUT

V_CE

-0.3 ~ 7.0

700

I_LX

250

600 (40mm x 40mm Standard board) ^(*2)

760 (JESD51-7 board) ^(*2)

120

SOT-25

Power Dissipation

(Ta=25℃)

USP-6EL

1000 (40mm x 40mm Standard board) ^(*2)

Operating Ambient Temperature

Storage Temperature

Topr

Tstg

-40 ~ 85

˚C

-55 ~ 125

* All voltages are described based on the GND.

^(*1)The maximum value should be either V_OUT+0.3V or 7.0V or in the lowest.

^(*2)This power dissipation figure shown is PCB mounted and is for reference only.

The mounting condition is please refer to PACKAGING INFORMATION

5/32

1 2 3 456 7 8...32

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