XC6217 Series
■PIN CONFIGURATION
VOUT
GO
4
VIN
4
VOUT
3
5
3 CE
GGOO 2
3 CCEE
2
1
VSS
5
VSS
VSS
VOUT
4
VIN
VOUT 1
VOUT
4
VIN
VIN
The USPN-4 is recommended to solder in
use of the reference mount pattern and
metal mask pattern for the mounting
strength.
1
2
The USP-4D heat dissipation pad is
recommended to solder in use of the
reference mount pattern and metal mask
pattern for the mounting strength and
heat dissipation.
1
2
3
CE
VSS
VIN
VSS
CE
USP-4D
SOT-25
SSOT-24
(TOP VIEW)
USPN-4
(BOTTOM VIEW)
(TOP VIEW)
(BOTTOM VIEW)
■PIN ASSIGNMENT
PIN NUMBER
SOT-25 SSOT-24
PIN NAME
FUNCTION
USP-4D
USPN-4
4
1
2
5
3
1
5
4
2
3
4
3
-
2
1
4
1
-
2
3
Power Input
Output
VIN
VOUT
GO
VSS
CE
Green Operation Mode Switch
Ground
ON/OFF Control
* XC6217A/B type: USP-4D package
XC6217A/B type: SOT-25 package
XC6217C/D type: SSOT-24 package
XC6217C/D type: USPN-4 package
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