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XBP24CDMRIS-001 PDF预览

XBP24CDMRIS-001

更新时间: 2022-09-29 18:25:28
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
180页 2660K
描述
XBEE-PRO S2C DIGIMESH 2.4 SMT RF

XBP24CDMRIS-001 数据手册

 浏览型号XBP24CDMRIS-001的Datasheet PDF文件第174页浏览型号XBP24CDMRIS-001的Datasheet PDF文件第175页浏览型号XBP24CDMRIS-001的Datasheet PDF文件第176页浏览型号XBP24CDMRIS-001的Datasheet PDF文件第177页浏览型号XBP24CDMRIS-001的Datasheet PDF文件第178页浏览型号XBP24CDMRIS-001的Datasheet PDF文件第179页 
PCB design and manufacturing  
Rework  
following information is given as a guideline in such cases to increase the chances of success during  
rework, though the warranty is still voided.  
The module may be removed from the OEM PCB by the use of a hot air rework station, or hot plate.  
Care should be taken not to overheat the module. During rework, the module temperature may rise  
above its internal solder melting point and care should be taken not to dislodge internal components  
from their intended positions.  
XBee/XBee-PRO S2C 802.15.4 RF Module User Guide  
180  

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