Datasheet > XBP06V4E4GR-G

XBP06V4E4GR-G

更新时间： 2022-05-08 16:34:57

品牌	Logo	应用领域
特瑞仕 - TOREX		/
页数	文件大小	规格书
4页	124K
描述
Transient Voltage Suppressor

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XBP06V4E4GR-G 数据手册

XBP06V4E4GR-G

■PACKAGING INFORMATION

●

USP-4 Power Dissipation

Power dissipation data for the USP-4 is shown in this page.

The value of power dissipation varies with the mount board conditions.

Please use this data as one of reference data taken in the described

condition.

1. Measurement Condition (Reference data)

Condition:

Ambient:

Soldering:

Board:

Mount on a board

Natural convection

Lead (Pb) free

Dimensions 40 x 40 mm (1600 mm²in one side)

Copper (Cu) traces occupy 50% of the board area

in top and back faces.

Package heat-sink is tied to the copper traces.

Glass Epoxy (FR-4)

Material:

Thickness:

Through-hole:

1.6 mm

4 x 0.8 Diameter

Evaluation Board (Unit: mm)

2. Power Dissipation vs. Ambient temperature

Board Mount (Tj max = 150℃)

Ambient Temperature (℃)

Power Dissipation Pd (mW)

Thermal Resistance (℃/W)

1000

125.00

150

Pd-Ta特性グラフ

Pd vs. Ta

1200

1000

800

600

400

200

100

125

150

Ambient Temperature: Ta (℃)

周囲温度Ta（℃）

3/4

1 234

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