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X5LS10106ASPGEQQ1R PDF预览

X5LS10106ASPGEQQ1R

更新时间: 2024-01-05 07:52:44
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德州仪器 - TI 闪存微控制器
页数 文件大小 规格书
101页 1144K
描述
16/32-BIT RISC Flash Microcontroller

X5LS10106ASPGEQQ1R 数据手册

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TMS570LS20216, TMS570LS20206, TMS570LS10216  
TMS570LS10206, TMS570LS10116, TMS570LS10106  
www.ti.com  
SPNS141MARCH 2010  
TMS570LS Series 16/32-BIT RISC Flash Microcontroller  
Check for Samples: TMS570LS20216, TMS570LS20206, TMS570LS10216, TMS570LS10206, TMS570LS10116, TMS570LS10106  
1 TMS570LS Series 16/32-BIT RISC Flash Microcontroller  
1.1 Features  
12  
• High-Performance Automotive Grade  
• Communication Interfaces  
Microcontroller for Safety Critical Applications  
– Certified for use in SIL3 Applications  
– Dual CPU’s running in Lockstep  
– Three Multi-buffered Serial Peripheral  
Interface (MibSPI) each with:  
Four chip selects and one Enable pin  
128 buffers with parity  
One with parallel mode  
– ECC on Flash and SRAM  
– CPU and Memory BIST (Built-In Self Test)  
– Error Signaling Module (ESM) w/ Error Pin  
• ARM® Cortex™-R4F 32-Bit RISC CPU  
– Two UART (SCI) interfaces with Local  
Interconnect Network Interface (LIN 2.0)  
– Three CAN (DCAN) Controller  
– Efficient 1.6 DMIPS/MHz with 8-stage  
pipeline  
– Floating Point Unit with Single/Double  
Precision  
Two with 64 mailboxes, one with 32  
Parity on mailbox RAM  
– Dual Channel FlexRay™ Controller  
– Memory Protection Unit (MPU)  
– Open Architecture With Third-Party Support  
• Operating Features  
8K-Byte message RAM with parity  
Transfer Unit with MPU and parity  
• High-End Timer (nHET)  
– Up to 160-MHz System Clock  
– Core Supply Voltage (VCC): 1.5 V  
– I/O Supply Voltage (VCCIO): 3.3 V  
• Integrated Memory  
– 1M-Byte or 2M-Byte Flash with ECC  
– 128K-Byte or 160K-Byte RAM with ECC  
• Multiple Communication interfaces including  
Flexray, CAN, and LIN  
– 32 Programmable I/O Channels  
– 128 Words High-End Timer RAM with parity  
– Transfer Unit with MPU and parity  
• Two 12-Bit Multi-Buffered ADCs (MibADC)  
– 24 total ADC Input channels  
– Each has 64 Buffers with parity  
• Trace and Calibration Interfaces  
– Embedded Trace Module (ETMR4)  
– Data Modification Module (DMM)  
– RAM Trace Port (RTP)  
• NHET Timer and 2x 12-bit ADC's  
• External Memory Interface (EMIF)  
– 16bit Data, 22bit Address, 4 Chip Selects  
• Common TMS470/570 Platform Architecture  
– Consistent Memory Map across the family  
– Real-Time Interrupt (RTI) OS Timer  
– Vectored Interrupt Module (VIM)  
– Cyclic Redundancy Checker (CRC)  
• Direct Memory Access (DMA) Controller  
– 32 Control Packets and 16 Channels  
– Parity on Control Packet Memory  
– Parameter Overlay Module (POM)  
• On-Chip emulation logic including IEEE 1149.1  
JTAG, Boundary Scan and ARM Coresight  
components  
• Full Development Kit Available  
– Development Boards  
– Code Composer Studio Integrated  
Development Environment (IDE)  
– HaLCoGen Code Generation Tool  
– HET Assembler and Simulator  
– nowFlash Flash Programming Tool  
• Packages Supported  
– Dedicated Memory Protection Unit (MPU)  
• Frequency-Modulated Zero-Pin Phase-Locked  
Loop (FMZPLL)-Based Clock Module  
– Oscillator and PLL clock monitor  
• Up to 115 Peripheral IO pins  
– 16 Dedicated GIO - 8 w/ External Interrupts  
– Programmable External Clock (ECLK)  
1
– 144-Pin Quad Flatpack (PGE) [Green]  
– 337-Pin Ball Grid Array (ZWT) [Green]  
• Community Resources  
TI E2E Community  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCT PREVIEW information concerns products in the formative  
or design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right  
to change or discontinue these products without notice.  
Copyright © 2010, Texas Instruments Incorporated  
 
 

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