5秒后页面跳转
WW25KR007JTL PDF预览

WW25KR007JTL

更新时间: 2024-04-09 18:57:19
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
7页 1171K
描述
2512(6432), 0.007Ω, ±5%, 2W

WW25KR007JTL 数据手册

 浏览型号WW25KR007JTL的Datasheet PDF文件第1页浏览型号WW25KR007JTL的Datasheet PDF文件第2页浏览型号WW25KR007JTL的Datasheet PDF文件第3页浏览型号WW25KR007JTL的Datasheet PDF文件第4页浏览型号WW25KR007JTL的Datasheet PDF文件第5页浏览型号WW25KR007JTL的Datasheet PDF文件第7页 
Approval sheet  
TEST AND REQUIREMENTS (JIS C 5201-1 : 1998)  
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category  
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp  
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.  
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical  
robustness testing procedure for electronic components" and under standard atmospheric conditions according  
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :  
Temperature: 15°C to 35°C.  
Relative humidity: 45% to 75%.  
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).  
All soldering tests are performed with midly activated flux.  
TEST  
PROCEDURE  
Natural resistance change per change in degree centigrade.  
R2 R  
REQUIREMENT  
Temperature Coefficient of  
Resistance(T.C.R)  
Refer to  
“QUICK REFERENCE DATA”  
106 (ppm/C) t1 : 20°C+5°C-1°C  
1
Clause 4.8  
R
1t2 t1   
R1 : Resistance at reference temperature  
R2 : Resistance at test temperature  
Permanent resistance change after a 5 second application of 5 times rated no visible damage  
power specified in the above list,  
Short time overload (S.T.O.L)  
Clause 4.13  
J: R/R max. ±(2%+0.5m)  
F: R/R max. ±(1%+0.5m)  
Un-mounted chips completely immersed for 10±1second in a SAC solder bath no visible damage  
Resistance to soldering heat  
(R.S.H)  
Clause 4.18  
at 270±5ºC  
J: R/R max. ±(1%+0.5m)  
F: R/R max. ±(0.5%+0.5m)  
Solderability  
Un-mounted chips completely immersed for 3±0.5 second in a SAC solder good tinning (>95% covered)  
bath at 235±2℃  
no visible damage  
Clause 4.17  
no visible damage  
Temperature cycling  
30 minutes at -55C3C, 2~3 minutes at 25°C+2°C-1°C, 30 minutes at  
+155C3C, 2~3 minutes at 25°C+2°C-1°C, total 5 continuous cycles  
J: R/R max. ±(1%+0.5m)  
F: R/R max. ±(0.5%+0.5m)  
Clause 4.19  
70±2ºC, 1000 hours, loaded with RCWV or Vmax,1.5 hours on and 0.5 hours no visible damage  
Load life (endurance)  
off  
J: R/R max. ±(3%+0.5m)  
F: R/R max. ±(1%+0.5m)  
1000 hours, at rated continuous working voltage in humidity chamber controller no visible damage  
Clause 4.25  
Load life in Humidity  
at 40C2C and 90~95% relative humidity, 1.5hours on and 0.5 hours off  
J: R/R max. ±(3%+0.5m)  
F: R/R max. ±(1%+0.5m)  
Min. 1Gohm  
Clause 4.24  
Resistance between termination and overcoat.  
test voltage 100+/-15V  
Insulation Resistance  
Clause 4.6  
Resistance change after bended 3mm on the 90mm PCB.  
2mm for 1206/ 2512!  
no visible damage  
Bending  
J: R/R max. ±(1%+0.5m)  
F: R/R max. ±(0.5%+0.5m)  
Clause 4.33  
Pressurizing force: 1Kg, Test time: 60±1sec.  
Adhesion  
No remarkable damage or removal  
of the terminations  
Clause 4.32  
Page 6 of 7  
ASC_WW25J WW25K_V05  
Dec – 2023  

与WW25KR007JTL相关器件

型号 品牌 描述 获取价格 数据表
WW25KR007JTLJ WALSIN Metal Plate Power Low Ohm Current Sense Chip-

获取价格

WW25KR008FTL WALSIN 2512(6432), 0.008Ω, ±1%, 2W

获取价格

WW25KR008FTLJ WALSIN Metal Plate Power Low Ohm Current Sense Chip-

获取价格

WW25KR008JTL WALSIN 2512(6432), 0.008Ω, ±5%, 2W

获取价格

WW25KR008JTLJ WALSIN Metal Plate Power Low Ohm Current Sense Chip-

获取价格

WW25KR009FTL WALSIN 2512(6432), 0.009Ω, ±1%, 2W

获取价格