Datasheet > WW06CR016JTL

WW06CR016JTL

更新时间： 2024-04-09 18:56:16

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
8页	188K
描述
0603(1608), 0.016Ω, ±5%, 1/4W

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WW06CR016JTL 数据手册

Approval sheet

TEST AND REQUIREMENTS

TEST

PROCEDURE

REQUIREMENT

Temperature

Coefficient of

Resistance

( TCR )

Natural resistance change per change in degree

centigrade.

Test temperature –55 ~ +125°C

As defined in P.3

R₂− R

×10⁶(ppm/°C)

(

t₂− t₁

)

R₁: Resistance at reference temperature

R₂: Resistance at test temperature

t₁: 25°C

Short time

Permanent resistance change after 2 second application

∆R/R max. ±1%

overload ( STOL ) of a current 2.5 times RCWC specified.

no visible damage

Sub-Clause 4.13

Resistance to

soldering heat

Un-mounted chips 10±0.5 seconds, 260±5ºC

no visible damage

∆ R/R max. ±1%

Sub-clause 4.18

Solderability

Termination Sn base (lead free) : Un-mounted chip good tinning (>95% covered)

completely immersed in a lead free solder bath,

235°C±5°C, 2±0.5 sec

Sub-clause 4.17

no visible damage

Temperature

cycling

no visible damage

1. 30 minutes at -55°C±3°C,

2. 2~3 minutes at room temperature,

3. 30 minutes at +125°±3°C,

∆R/R max. ±1%

Sub-clause 4.19

4. 2~3 minutes at room temperature,

Total 5 continuous cycles

Load life

(endurance)

70±2ºC, 1000 hours, loaded with rated current,

1.5 hours on and 0.5 hours off

∆R/R max. ±5%

no visible damage

Sub-clause 4.25.1

Steady state in

Humidity

1000hrs without current applied in humidity chamber

∆R/R max. ±5%

controller at 40°C±2°C and 90~95% relative humidity

no visible damage

Sub-clause 4.24

Bending strength

Sub-clause 4.33

Resistors mounted on a 90mm glass epoxy resin

PCB(FR4); bending : 3 mm,

∆R/R max. ±1%

no visible damage

No visible damage

Adhesion

5N, 10±1s ( WW02C: 3N)

Sub-clause 4.32

Page 6 of 8

ASC_WWxxC_V07

Jan 2014

1...3 4 567 8

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