是否Rohs认证: | 不符合 | 生命周期: | Active |
零件包装代码: | PGA | 包装说明: | PGA, |
针数: | 66 | Reach Compliance Code: | compliant |
HTS代码: | 8542.32.00.71 | 风险等级: | 5.03 |
其他特性: | SRAM IS ORGANISED AS 512K X 16 | JESD-30 代码: | S-CPGA-P66 |
JESD-609代码: | e4 | 长度: | 35.2 mm |
内存密度: | 8388608 bit | 内存集成电路类型: | MEMORY CIRCUIT |
内存宽度: | 16 | 功能数量: | 1 |
端子数量: | 66 | 字数: | 524288 words |
字数代码: | 512000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 512KX16 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | PGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 座面最大高度: | 5.7 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | GOLD | 端子形式: | PIN/PEG |
端子节距: | 2.54 mm | 端子位置: | PERPENDICULAR |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 35.2 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
WSF512K16-72H2CA | WEDC |
获取价格 |
512KX16 SRAM/FLASH MODULE, SMD 5962-96901 |
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WSF512K16-72H2CA | MICROSEMI |
获取价格 |
Memory Circuit, 512KX16, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-6 |
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WSF512K16-72H2I | WEDC |
获取价格 |
512KX16 SRAM/FLASH MODULE, SMD 5962-96901 |
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WSF512K16-72H2I | MICROSEMI |
获取价格 |
Memory Circuit, 512KX16, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-6 |
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WSF512K16-72H2IA | WEDC |
获取价格 |
512KX16 SRAM/FLASH MODULE, SMD 5962-96901 |
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WSF512K16-72H2IA | MICROSEMI |
获取价格 |
Memory Circuit, 512KX16, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-6 |
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WSF512K16-72H2M | WEDC |
获取价格 |
512KX16 SRAM/FLASH MODULE, SMD 5962-96901 |
![]() |
WSF512K16-72H2M | MICROSEMI |
获取价格 |
Memory Circuit, 512KX16, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-6 |
![]() |
WSF512K16-72H2MA | MICROSEMI |
获取价格 |
Memory Circuit, 512KX16, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-6 |
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WSF512K16-72H2MA | WEDC |
获取价格 |
512KX16 SRAM/FLASH MODULE, SMD 5962-96901 |
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