生命周期: | Active | 零件包装代码: | DIP |
包装说明: | 0.300 INCH, CERAMIC, DIP-28 | 针数: | 28 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.61 | 风险等级: | 5.08 |
最长访问时间: | 55 ns | JESD-30 代码: | R-CDIP-T28 |
内存密度: | 262144 bit | 内存集成电路类型: | UVPROM |
内存宽度: | 8 | 功能数量: | 1 |
端子数量: | 28 | 字数: | 32768 words |
字数代码: | 32000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
组织: | 32KX8 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | DIP | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 并行/串行: | PARALLEL |
认证状态: | Not Qualified | 筛选级别: | MIL-STD-883 Class C |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | MILITARY |
端子形式: | THROUGH-HOLE | 端子位置: | DUAL |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
WS57C256F-70 | STMICROELECTRONICS |
获取价格 |
MILITARY HIGH SPEED 32K x 8 CMOS EPROM |
![]() |
WS57C256F-70CMB | STMICROELECTRONICS |
获取价格 |
MILITARY HIGH SPEED 32K x 8 CMOS EPROM |
![]() |
WS57C256F-70D | STMICROELECTRONICS |
获取价格 |
HIGH SPEED 32K x 8 CMOS EPROM |
![]() |
WS57C256F-70DMB | STMICROELECTRONICS |
获取价格 |
MILITARY HIGH SPEED 32K x 8 CMOS EPROM |
![]() |
WS57C256F-70J | STMICROELECTRONICS |
获取价格 |
HIGH SPEED 32K x 8 CMOS EPROM |
![]() |
WS57C256F-70JI | STMICROELECTRONICS |
获取价格 |
HIGH SPEED 32K x 8 CMOS EPROM |
![]() |
WS57C256F-70T | STMICROELECTRONICS |
获取价格 |
HIGH SPEED 32K x 8 CMOS EPROM |
![]() |
WS57C291C | STMICROELECTRONICS |
获取价格 |
MILITARY HIGH SPEED 2K x 8 CMOS PROM/RPROM |
![]() |
WS57C291C- | STMICROELECTRONICS |
获取价格 |
WS57C191C/291C MILITARY HIGH SPEED 2K X 8 CMOS PROM/RPROM |
![]() |
WS57C291C-1 | STMICROELECTRONICS |
获取价格 |
MILITARY HIGH SPEED 2K x 8 CMOS PROM/RPROM |
![]() |