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WMS512K8-55FEMA PDF预览

WMS512K8-55FEMA

更新时间: 2024-01-02 10:13:13
品牌 Logo 应用领域
其他 - ETC 内存集成电路静态存储器
页数 文件大小 规格书
10页 118K
描述
512Kx8 MONOLITHIC SRAM

WMS512K8-55FEMA 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:DFP包装说明:DFP, FL36,.5
针数:36Reach Compliance Code:compliant
ECCN代码:3A001.A.2.CHTS代码:8542.32.00.41
风险等级:5.06最长访问时间:55 ns
I/O 类型:COMMONJESD-30 代码:R-CDFP-F36
长度:23.37 mm内存密度:4194304 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
功能数量:1端口数量:1
端子数量:36字数:524288 words
字数代码:512000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:512KX8输出特性:3-STATE
可输出:YES封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:DFP封装等效代码:FL36,.5
封装形状:RECTANGULAR封装形式:FLATPACK
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified反向引出线:NO
筛选级别:MIL-PRF-38534 Class H座面最大高度:2.72 mm
最大待机电流:0.00045 A最小待机电流:4.5 V
最大压摆率:0.16 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:FLAT
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:12.95 mm
Base Number Matches:1

WMS512K8-55FEMA 数据手册

 浏览型号WMS512K8-55FEMA的Datasheet PDF文件第2页浏览型号WMS512K8-55FEMA的Datasheet PDF文件第3页浏览型号WMS512K8-55FEMA的Datasheet PDF文件第4页浏览型号WMS512K8-55FEMA的Datasheet PDF文件第5页浏览型号WMS512K8-55FEMA的Datasheet PDF文件第6页浏览型号WMS512K8-55FEMA的Datasheet PDF文件第7页 
WMS512K8-XXX  
HI-RELIABILITY PRODUCT  
512Kx8 MONOLITHIC SRAM, SMD 5962-95613  
FEATURES  
32 pin, Rectangular Ceramic Leadless Chip Carrier  
(Package 601)  
Access Times 15, 17, 20, 25, 35, 45, 55ns  
MIL-STD-883 Compliant Devices Available  
Commercial, Industrial and Military Temperature Range  
5 Volt Power Supply  
Revolutionary, Center Power/Ground Pinout  
JEDEC Approved  
• 36 lead Ceramic SOJ (Package 100)  
• 36 lead Ceramic Flat Pack (Package 226)  
Low Power CMOS  
Low Power Data Retention for Battery Back-up Operation  
TTL Compatible Inputs and Outputs  
Evolutionary, Corner Power/Ground Pinout  
JEDEC Approved  
• 32 pin Ceramic DIP (Package 300)  
• 32 lead Ceramic SOJ (Package 101)  
• 32 lead Ceramic Flat Pack (Package 220)  
• 32 lead Ceramic Flat Pack (Package 142)  
REVOLUTIONARY PINOUT  
EVOLUTIONARY PINOUT  
32 DIP  
36 FLAT PACK  
36 CSOJ  
32 CSOJ (DE)  
32 FLAT PACK (FE)*  
32 FLAT PACK (FD)  
32 CLCC  
TOP VIEW  
TOP VIEW  
TOP VIEW  
A0  
A1  
1
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
NC  
A18  
A16  
A14  
A12  
A7  
1
32  
VCC  
2
A18  
A17  
A16  
A15  
OE  
2
31 A15  
30 A17  
29 WE  
28 A13  
27 A8  
4
3 2 1 32 31 30  
A2  
3
3
5
29  
28  
27  
26  
25  
24  
23  
22  
21  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
WE  
A13  
A8  
A3  
4
4
6
A4  
5
5
CS  
I/O0  
I/O1  
6
7
A6  
6
7
I/O7  
I/O6  
GND  
8
A5  
7
26 A9  
A9  
8
A4  
8
25 A11  
24 OE  
23 A10  
22 CS  
21 I/O7  
20 I/O6  
19 I/O5  
18 I/O4  
17 I/O3  
9
A11  
OE  
A10  
CS  
VCC  
9
A3  
9
10  
11  
12  
13  
GND  
I/O2  
I/O3  
WE  
A5  
10  
11  
12  
13  
14  
15  
16  
17  
18  
VCC  
A2  
10  
11  
12  
13  
14  
15  
16  
I/O5  
I/O4  
A14  
A13  
A12  
A11  
A10  
NC  
A1  
A0  
I/O  
0
I/O7  
I/O0  
I/O1  
I/O2  
GND  
14 15 16 17 18 19 20  
A6  
A7  
A8  
A9  
PIN DESCRIPTION  
A0-18  
I/O0-7  
CS  
Address Inputs  
Data Input/Output  
Chip Select  
OE  
Output Enable  
Write Enable  
+5.0V Power  
Ground  
WE  
VCC  
GND  
*Package not recommended for new designs, "FD" recommended for new designs.  
1
White Electronic Designs Corporation • (602) 437-1520  
www.whiteedc.com  
October 2000 Rev. 4  

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