13. Reliability Performance
Reliability Experiment For Electrical
Test Item
Accept criteria
Test Condition
Standard Source
1.Change from an initial
value L:within±5%
2.no visible damage.
1.Change from an initial
value L:within±5%
2.no visible damage.
1.Change from an initial
value L:within±5%
MIL-STD-202H
Method 103
Test Condition B
+40℃± 2℃, humidity of 90% ±5% (total 96
hours).
Humidity Test
1.Temperature: +125℃±2℃.
2.Test time: 72±2hrs.
High Temperature
Test
IEC 68-2
Test Condition B
1.Temperature: -25℃±2℃.
2.Test time: 72±2hrs.
Low Temperature
Test
IEC 68-2
Test Condition A
2.no visible damage.
Reference
MIL-STD-202H
Method 107
Test Condition B-2
Reference
MIL-STD-202H
Method 108
Test Condition B
+125℃±5℃ (30 minutes) ~ -65±5℃ (30
minutes), temperature switch time: 5 minutes
(total 50 cycles).
1.Change from an initial
value L:within±5%
2.no visible damage.
Thermal Shock
Life Test
1.Change from an initial
value L:within±5%
2.no visible damage.
+70℃±5℃ (250Hours).
Reliability Experiment For Physical
Test Item
Accept criteria
Test Condition
Standard Source
1.Change from an initial
value L:within±5%
2.no visible damage.
10-55-10HZ, amplitude: 1.5mm, direction: X, Y, Z MIL-STD-202H
Vibration Test
axes, each axis 2 hours (total 6 hours).
Method 201
Reference
IR/convection reflow: Peak Temp 250±5℃ for
30±5Sec. in air, Through 3 Cycle. Temperature
Ramp:+1~4°C/sec.; Above 183°C, must keep 90 s
- 120 s.
MIL-STD-202H
Method 210
Test Condition K
(Reflow)
Solder Heat
Resistance Test
1.no visible damage.
Solder temp: 245±5℃,
Immersion time: 5 second.
Immersion rate: 25±6mm/sec.
1. Lead must have 95%
above coverage.
J-STD-002D
Test condition B1
Solder Ability Test
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