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WF20U3160ATLQ PDF预览

WF20U3160ATLQ

更新时间: 2024-03-18 21:37:46
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
10页 1653K
描述
Thin Film Professional AEC-Q200 Chip Resistor / WF.Q Series 316Ω, ±0.05%, ≦±25, 1/2W

WF20U3160ATLQ 数据手册

 浏览型号WF20U3160ATLQ的Datasheet PDF文件第3页浏览型号WF20U3160ATLQ的Datasheet PDF文件第4页浏览型号WF20U3160ATLQ的Datasheet PDF文件第5页浏览型号WF20U3160ATLQ的Datasheet PDF文件第7页浏览型号WF20U3160ATLQ的Datasheet PDF文件第8页浏览型号WF20U3160ATLQ的Datasheet PDF文件第9页 
Approval Sheet  
SOLDERING CONDITION  
The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260°C for 10  
seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete  
components on the reverse (mixed PCBs).  
Surface Mount Resistors are tested for solderability at 235°C during 2 seconds within lead-free solder bath. The  
test condition for no leaching is 260°C for 30 seconds. Typical examples of soldering profile and condition that  
provide reliable joints without any damage are given in Fig 3. and Table 1.  
Fig. 3 Infrared soldering profile for Chip Resistors  
Table 1. Infrared soldering condition for Chip Resistors  
Temperature Condition  
Average ramp-up rate (217°C to 260°C)  
Between 150 and 200°C  
> 217°C  
Exposure Time  
Less than 3°C/second  
Between 60-120 seconds  
Between 60-150 seconds  
260ºC +0/-5°C  
Peak Temperature  
Min. 30 seconds  
Time within 245°C  
Ramp-down rate (Peak to 217°C)  
Time from 25°C to Peak  
Less than 6°C/second  
No greater than 480 seconds  
Page 6 of 10  
ASC_WFxxT&U_Q  
Mar - 2018  

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