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WF20P1131FTLV PDF预览

WF20P1131FTLV

更新时间: 2024-04-09 18:46:45
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
9页 1041K
描述
2010(5025), 1130Ω, ±1%, 1W

WF20P1131FTLV 数据手册

 浏览型号WF20P1131FTLV的Datasheet PDF文件第3页浏览型号WF20P1131FTLV的Datasheet PDF文件第4页浏览型号WF20P1131FTLV的Datasheet PDF文件第5页浏览型号WF20P1131FTLV的Datasheet PDF文件第6页浏览型号WF20P1131FTLV的Datasheet PDF文件第8页浏览型号WF20P1131FTLV的Datasheet PDF文件第9页 
Approval sheet  
TEST AND REQUIREMENTS  
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category  
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp heat,  
long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.  
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical  
robustness testing procedure for electronic components" and under standard atmospheric conditions according  
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :  
Temperature: 15°C to 35°C.  
Relative humidity: 45% to 75%.  
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).  
All soldering tests are performed with midly activated flux.  
REQUIREMENT  
TEST  
PROCEDURE / TEST METHOD  
Resistor  
Within the specified tolerance  
Refer to “QUICK REFERENCE  
DATA”  
Electrical Characteristics  
- DC resistance values measurement  
- Temperature Coefficient of Resistance (T.C.R)  
Natural resistance change per change in degree  
centigrade.  
JISC5201-1: 1998  
Clause 4.8  
R2 R  
106 (ppm/C)  
t1 : 20°C+5°C-1°C  
1
R
1t2 t1   
R1 : Resistance at reference temperature  
R2 : Resistance at test temperature  
Un-mounted chips completely immersed for 10±1second  
in a SAC solder bath at 270±5ºC  
Resistance to soldering  
heat(R.S.H)  
ΔR/R max. (1.0%+0.05)  
no visible damage  
MIL-STD-202  
method 210  
a) Bake the sample for 155dwell time 4hrs/ solder  
dipping 235/ 5sec.  
Solderability  
J-STD-002  
95% coverage min., good  
tinning and no visible damage  
b) Steam the sample dwell time 8 hour/ solder dipping 215  
/ 5sec.  
c) Steam the sample dwell time 8 hour/ solder dipping 260  
/ 7sec.  
1000 cycles, -55  
~
+155, dwell time 30min R/R max. (1.0%+0.05)  
Temperature cycling  
JESD22  
maximum.  
No visible damage  
Method JA-104  
R/R max. (1.0%+0.05)  
No visible damage  
Moisture Resistance  
MIL-STD-202  
652C, 80~100% RH, 10 cycles, 24 hours/ cycle  
method 106  
1000+48/-0 hours; 85C, 85% RH, 10% of operation R/R max. (2.0%+0.10)  
Bias Humidity  
MIL-STD-202  
method 103  
power  
No visible damage  
Operational Life  
1000+48/-0 hours; 35% of operation power, 1252C  
R/R max. (2.0%+0.1)  
MIL-STD-202  
108  
method  
No visible damage  
High Temperature Exposure 1000+48/-0 hours; without load in  
a
temperature R/R max. (2.0%+0.10)  
MIL-STD-202  
Method 108  
chamber controlled 1553C  
No visible damage  
Page 7 of 9  
ASC_WFxxP_V_V03  
Mar – 2023  

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