Datasheet > WF04U20R0BTLS

WF04U20R0BTLS

更新时间： 2022-05-14 22:17:16

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
11页	878K
描述
Low resistance with superior pulse withstand ability

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WF04U20R0BTLS 数据手册

Approval Sheet

SOLDERING CONDITION

The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260C for

10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete

components on the reverse (mixed PCBs).

Surface Mount Resistors are tested for solderability at 245C during 5 seconds within lead-free solder bath. The

test condition for no leaching is 260C for 30 seconds. Typical examples of soldering profile and condition that

provide reliable joints without any damage are given in Fig 3. and Table 1.

Fig. 3 Infrared soldering profile for Chip Resistors

Table 1. Infrared soldering condition for Chip Resistors

Temperature Condition

Average ramp-up rate (217C to 260C)

Between 150 and 200C

> 217C

Exposure Time

Less than 3C/second

Between 60-120 seconds

Between 60-150 seconds

260ºC +0/-5C

Peak Temperature

Min. 30 seconds

Time within 245C

Ramp-down rate (Peak to 217C)

Time from 25C to Peak

Less than 6C/second

No greater than 480 seconds

Page 6 of 11

ASC_WFxxS V01

Aug - 2018

1...3 4 567 8 9...11

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