Datasheet > WF04T1000UVLQ

WF04T1000UVLQ

更新时间： 2022-05-14 22:13:38

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
10页	1653K
描述
High Precision Thin Film Chip Resistors

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WF04T1000UVLQ 数据手册

Approval Sheet

SOLDERING CONDITION

The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260°C for 10

seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete

components on the reverse (mixed PCBs).

Surface Mount Resistors are tested for solderability at 235°C during 2 seconds within lead-free solder bath. The

test condition for no leaching is 260°C for 30 seconds. Typical examples of soldering profile and condition that

provide reliable joints without any damage are given in Fig 3. and Table 1.

Fig. 3 Infrared soldering profile for Chip Resistors

Table 1. Infrared soldering condition for Chip Resistors

Temperature Condition

Average ramp-up rate (217°C to 260°C)

Between 150 and 200°C

> 217°C

Exposure Time

Less than 3°C/second

Between 60-120 seconds

Between 60-150 seconds

260ºC +0/-5°C

Peak Temperature

Min. 30 seconds

Time within 245°C

Ramp-down rate (Peak to 217°C)

Time from 25°C to Peak

Less than 6°C/second

No greater than 480 seconds

Page 6 of 10

ASC_WFxxT&U_Q

Mar - 2018

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