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WF04R1000ATL PDF预览

WF04R1000ATL

更新时间: 2022-05-14 22:13:50
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
10页 1802K
描述
High Precision Power Thin Film Chip Resistors

WF04R1000ATL 数据手册

 浏览型号WF04R1000ATL的Datasheet PDF文件第3页浏览型号WF04R1000ATL的Datasheet PDF文件第4页浏览型号WF04R1000ATL的Datasheet PDF文件第5页浏览型号WF04R1000ATL的Datasheet PDF文件第7页浏览型号WF04R1000ATL的Datasheet PDF文件第8页浏览型号WF04R1000ATL的Datasheet PDF文件第9页 
Approval Sheet  
SOLDERING CONDITION  
The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260°C for 10  
seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete  
components on the reverse (mixed PCBs).  
Surface Mount Resistors are tested for solderability at 235°C during 2 seconds within lead-free solder bath. The  
test condition for no leaching is 260°C for 30 seconds. Typical examples of soldering profile and condition that  
provide reliable joints without any damage are given in Fig 3. and Table 1.  
Fig. 3 Infrared soldering profile for Chip Resistors  
Table 1. Infrared soldering condition for Chip Resistors  
Temperature Condition  
Average ramp-up rate (217°C to 260°C)  
Between 150 and 200°C  
> 217°C  
Exposure Time  
Less than 3°C/second  
Between 60-120 seconds  
Between 60-150 seconds  
260ºC +0/-5°C  
Peak Temperature  
Min. 30 seconds  
Time within 245°C  
Ramp-down rate (Peak to 217°C)  
Time from 25°C to Peak  
Less than 6°C/second  
No greater than 480 seconds  
Page 6 of 10  
ASC_WFxxQ&R  
Mar - 2019  

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