是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | DIMM, | Reach Compliance Code: | unknown |
风险等级: | 5.66 | 访问模式: | SINGLE BANK PAGE BURST |
其他特性: | AUTO/SELF REFRESH | JESD-30 代码: | R-XZMA-N144 |
JESD-609代码: | e4 | 内存密度: | 4831838208 bit |
内存集成电路类型: | SYNCHRONOUS DRAM MODULE | 内存宽度: | 72 |
功能数量: | 1 | 端口数量: | 1 |
端子数量: | 144 | 字数: | 67108864 words |
字数代码: | 64000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 64MX72 | 封装主体材料: | UNSPECIFIED |
封装代码: | DIMM | 封装形状: | RECTANGULAR |
封装形式: | MICROELECTRONIC ASSEMBLY | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 自我刷新: | YES |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Gold (Au) | 端子形式: | NO LEAD |
端子位置: | ZIG-ZAG | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
WED3DG7266V75D1I-SG | WEDC |
获取价格 |
512MB - 64Mx72 SDRAM, UNBUFFERED, w/PLL |
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WED3DG7266V75D1I-XX | WEDC |
获取价格 |
512MB - 64Mx72 SDRAM, UNBUFFERED, w/PLL |
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WED3DG7266V75D1MG | MICROSEMI |
获取价格 |
64MX72 SYNCHRONOUS DRAM MODULE, ZMA144, ROHS COMPLIANT, SODIMM-144 |
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WED3DG7266V75D1-SG | WEDC |
获取价格 |
Synchronous DRAM Module, 64MX72, CMOS, ROHS COMPLIANT, SO-DIMM, 144 PIN |
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WED3DG7266V75D1XX | WEDC |
获取价格 |
512MB - 64Mx72 SDRAM, UNBUFFERED, w/PLL |
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WED3DG7266V7D1I-MG | WEDC |
获取价格 |
512MB - 64Mx72 SDRAM, UNBUFFERED, w/PLL |
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WED3DG7266V7D1I-SG | WEDC |
获取价格 |
512MB - 64Mx72 SDRAM, UNBUFFERED, w/PLL |
![]() |
WED3DG7266V7D1I-XX | WEDC |
获取价格 |
512MB - 64Mx72 SDRAM, UNBUFFERED, w/PLL |
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WED3DG7266V7D1MG | MICROSEMI |
获取价格 |
64MX72 SYNCHRONOUS DRAM MODULE, ZMA144, ROHS COMPLIANT, SODIMM-144 |
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WED3DG7266V7D1SG | MICROSEMI |
获取价格 |
64MX72 SYNCHRONOUS DRAM MODULE, ZMA144, ROHS COMPLIANT, SODIMM-144 |
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