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WCR2512 PDF预览

WCR2512

更新时间: 2023-12-06 19:52:53
品牌 Logo 应用领域
TTELEC /
页数 文件大小 规格书
3页 519K
描述
General purpose surface mounted resistor

WCR2512 技术参数

生命周期:Active包装说明:, 2512
Reach Compliance Code:compliant风险等级:5.67
其他特性:RATED CURRENT: 2AJESD-609代码:e3
安装特点:SURFACE MOUNT端子数量:2
最高工作温度:155 °C最低工作温度:-55 °C
封装形状:RECTANGULAR PACKAGE包装方法:TR, 7/10 INCH
额定温度:70 °C电阻器类型:FIXED RESISTOR
尺寸代码:2512子类别:Fixed Resistors
表面贴装:YES技术:METAL GLAZE/THICK FILM
端子面层:TIN OVER NICKEL端子形状:WRAPAROUND
工作电压:200 VBase Number Matches:1

WCR2512 数据手册

 浏览型号WCR2512的Datasheet PDF文件第2页浏览型号WCR2512的Datasheet PDF文件第3页 
General Purpose Surface  
Mounted Resistors  
WCR Series  
Features  
Excellent reliability  
Wide range of sizes and ohmic values  
ꢀ Wrapꢀaroundꢀterminaꢁons  
ꢀ Innerꢀelectrodeꢀprotecꢁon  
AEC-Q200 grade available  
AllꢀpartsꢀareꢀPb-freeꢀandꢀcomplyꢀwithꢀEUꢀDirecꢁveꢀ2011/65/EUꢀamendedꢀbyꢀ(EU)ꢀ2015/863ꢀ(RoHS3)  
Electrical Data  
0201  
0402  
0603  
0805  
1206  
1210  
2010  
2512  
0.05  
0.063  
0.1  
0.125  
0.25  
1R0 to 10M  
0.25  
0.5  
1.0  
Power rating @ 70°C  
Resistance range  
watts  
ohms 10R to 1M0 1R0 to 1M0  
Resistance Range AEC-Q200  
10R to 1M0  
ohms  
25  
200  
50  
75  
150  
100  
200  
2
Limiting element votage  
TCR*  
Resistance Tolerance  
Standard values  
Ambient temperature range  
Zero-ohm Jumper Chip Rating  
volts  
ppm/°C  
%
200  
1
E24 or E96  
-55 to 155  
1.5  
°C  
amps  
0.5  
1
Zero-ohm Jumper Chip Resistance milliohms  
<50  
* Notes – TCR for low values 1R to 10R: -400 to +600ppm/ºC, 11R to 100R: ±±00ppm/ºC  
TCR for high values 3M3 to 10M: ±300ppm/ºC  
Physical Data  
Dimensions (mm)  
L
T
C
A
W
Style  
0201  
0402  
0603  
0805  
1206  
1210  
2010  
2512  
C
0.6 ± 0.03  
1.0 ± 0.1  
1.6 ± 0.1  
2.0 ± 0.15  
3.1 ± 0.15  
3.1 ± 0.1  
5.0 ± 0.1  
6.35 ± 0.1  
0.23 ± 0.03  
0.35 ± 0.05  
0.45 ± 0.1  
0.55 ± 0.1  
0.55 ± 0.1  
0.55 ± 0.1  
0.55 ± 0.1  
0.55 ± 0.1  
0.1 ± 0.05  
0.2 ± 0.1  
0.15 ± 0.05  
0.25 ± 0.1  
0.3 ± 0.2  
0.4 ± 0.2  
0.45 ± 0.2  
0.5 ± 0.2  
0.5 ± 0.2  
0.5 ± 0.2  
0.3 ± 0.03  
0.5 ± 0.05  
0.8 ± 0.1  
T
0.3 ± 0.2  
A
0.4 ± 0.2  
1.25 + 0.15 -0.1  
1.55 + 0.15 -0.1  
2.6 ± 0.2  
0.45 ± 0.2  
0.5 ± 0.25  
0.60 ± 0.25  
0.60 ± 0.25  
L
W
A
Wrap-around terminations  
(3 faces)  
2.5 ± 0.2  
3.2 ± 0.2  
Figure 1  
Construction  
Tin Plating  
The chips have a high alumina substrate (96% minimum) with  
Nickel Barrier  
a ruthenium oxide resistance element and silver palladium,  
Dipped Conductor  
coat  
nickel and tin plated terminations. A glazed protection  
is applied to the resistive element (See Fig.1)  
E
Protection  
Glass Dielectric  
Resistance Element  
Terminations  
Solderability  
Silver  
Palladium  
The terminations meet the requirements of  
IEC 115-1, Clause 4.17.3.2.  
Strength  
The terminations meet requirements of  
IEC 68.2.21.  
96% min Alumina Substrate  
General Note  
BIꢀTechnologiesꢀꢀꢀꢀIRCꢀꢀꢀꢀWelwyn  
TTꢀElectronicsꢀreservesꢀtheꢀrightꢀtoꢀmakeꢀchangesꢀinꢀproductꢀspecificaꢁonꢀwithoutꢀnoꢁceꢀorꢀliability.  
AllꢀinformaꢁonꢀisꢀsubjectꢀtoꢀTTꢀElectronics’ꢀownꢀdataꢀandꢀisꢀconsideredꢀaccurateꢀatꢀꢁmeꢀofꢀgoingꢀtoꢀprint.  
www.ꢂelectronics.com/resistors  
© TT Electronics plc  
04.23  

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