Datasheet > WCA3225CGR18J

WCA3225CGR18J

更新时间： 2024-04-09 18:57:37

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
7页	922K
描述
SMD Wire Wound Ceramic Chip RF Inductor (AEC-Q200) / WCA Series 180, 60, 500mA

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WCA3225CGR18J 数据手册

10. Reliability Performance

Test Item

Accept criteria

Test Condition

Standard Source

1000 hrs. at rated operating temperature (e.g.

125°C part can be stored for 1000 hrs. @ 125°C.

Same applies for 105°C and 85°C. Unpowered.

Measurement at 24±4 hours after test conclusion.

1.Change from an initial

value L:within±5%

2.no visible damage.

High Temperature

Exposure (Storage)

AEC-Q200 RevD

Table 5

1000 cycles (-40°C to +125°C). Note: If 85°C part or

105°C part the 1000 cycles will be at that

temperature. Measurement at 24±4 hours after

test conclusion. 30min maximum dwell time at

each temperature extreme. 1 min. maximum

transition time.

1.Change from an initial

value L:within±5%

2.no visible damage.

AEC-Q200 RevD

Table 5

Temperature Cycling

1.Change from an initial

value L:within±5%

2.no visible damage.

1000 hours 85°C/85%RH. Unpowered.

Measurement at 24±4 hours after test conclusion. Table 5

AEC-Q200 RevD

Biased Humidity

Operational Life

1.Change from an initial 1000 hrs. @ 105°C. If 85°C or 125°C part will be

value L:within±5%

2.no visible damage.

AEC-Q200 RevD

Table 5

tested at that temperature. Measurement at 24±4

hours after test conclusion.

1.Change from an initial

value L:within±5%

2.no visible damage.

MIL-STD-202

Method 213

Condition C

Peak Value: 100g’s, Duration: 6ms, Waveform:

Half-sine Velocity Change: 12.3ft/sec.

Mechanical Shock

Vibration

5g's for 20 minutes, 12 cycles each of 3

orientations.

Note: Use 8"X5" PCB, .031" thick, 7 secure points

1.Change from an initial

value L:within±5%

2.no visible damage.

AEC-Q200 RevD

on one long side and 2 secure points at corners of Table 5

opposite sides. Parts mounted within 2" from any

secure point. Test from 10-2000 Hz.

Condition K: Reflow temp:250±5℃,

Peak time: 30±5sec, Temp ramp: 1°C/s-4°C/s; time

above 183°C, 90 s - 120 s, Cycles: 3.

Resistance to

Soldering Heat

MIL-STD-202

Method 210

1.no visible damage.

1.Change from an initial

value L:within±5%

2.no visible damage.

AEC-Q200-002

ISO/DIS10605

Passive Component Human Body Model (HBM)

direct contact discharge 8KV.

ESD

1. Lead must have 95%

above coverage.

AEC-Q200 RevD

Table 5

SMD: a) Method B, 4hrs@155℃ dry heat, @235℃

Solder ability

Flammability

1.Meet UL-94 V0 or V1

request

V-0 or V-1 Acceptable.

UL-94

1.Change from an initial 100mmX40mm board mechanical means to apply

Board Flex

value L:within±5%

a force which will bend the board (D) x = 2 mm

AEC-Q200-005

AEC-Q200-006

2.no visible damage.

minimum, applied forces shall be 60 (+ 5) Sec.

Terminal Strenh

(SMD)

1.Component can’t drop

2.no visible damage.

1.8Kg force, applied for 60 second.

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