Datasheet > WA02F390 JTL

WA02F390 JTL

更新时间： 2024-04-09 18:56:19

阅读下载

获取价格

如果您发现信息不准确，欢迎纠错

WA02F390 JTL 数据手册

Approval sheet

FEATURE

1. Small size and light weight

2. Reduced size of final equipment

3. Lower surface mounted assembly costs

4. Higher component and equipment reliability

5. Lead free / Halogen free

6. Anti-Sulfuration ASTM B-809 compliant

APPLICATION



Consumer electrical equipment, PDA, Digital Cam-coder, …

EDP, Computer application

Mobile phone, Telecom

Ram module

DESCRIPTION

The resistors array is constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are

added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The

composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to

within tolerance by laser cutting of this resistive layer.

The resistive layer is covered with a BLACK protective coat. The top side is WITHOUT protective coat. Finally,

the two external end terminations are added. For ease of soldering the outer layer of these end terminations is a

Tin (lead free) solder alloy..

Fig 1. Outline of chip-R array WA02F

Page 2 of 7

ASC_WA02F_V05

JAN - 2022

123 4 5 6 7

下载PDF