VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
Voꢀtꢂge
Cꢂpꢂcꢁtꢂnce
Cꢂse
Sꢁze
TC ꢂnd
Dꢁeꢀectrꢁc
Serꢁes
Descrꢁptꢁon
[Mꢁn. V] [Mꢂx. V]
[Mꢁn.]
[Mꢂx.]
VJ Commercꢁꢂꢀ
Serꢁes
FEaTURES
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
25
100
200
500
220 pF
1.0 nF
4.7 nF
10 nF
12 nF
10 nF
22 nF
39 nF
47 nF
56 nF
47 nF
150 nF
470 nF
1.0 µF
1.0 µF
270 nF
1.0 µF
2.7 µF
2.2 µF
4.7 µF
6.8 µF
• Surface-mount multilayer ceramic chip capacitors
• C0G (NP0) offers ultra-stable dielectric and low
power dissipation
1.0 pF
• Polymer terminations available with C0G (NP0)/
X7R for board flex requirements for size 0603 and
larger
• AgPd terminations available for silver epoxy
bonding
• Wet build process
• Reliable Noble Metal Electrode (NME)system
aPPliCaTiONS
• Timing and tuning circuits
• Filtering and decoupling
• Sensor and scanner applications
• Surge suppression
630
56 pF
18 pF
39 pF
100 pF
C0G (NP0)
50
1000
500
1000
270 pF
120 pF
100
200
250
• Power supplies
16
330 pF
630
390 pF
470 pF
1.0 nF
10 nF
15 nF
33 nF
27 nF
X7R
50
25
50
25
1000
500
1000
500
VJ hꢁgꢄ Q
Dꢁeꢀectrꢁc
Commercꢁꢂꢀ Serꢁes
FEaTURES
• Surface-mount multilayer ceramic chip capacitors
• High Q at high frequencies
• Low ESR and dissipation factor
• AgPd terminations available for silver epoxy
bonding
0603
0805
100
200
100 pF
220 pF
High-Q
C0G (NP0)
• Wet build process
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• Timing and tuning circuits
• Filtering and decoupling
• Sensor applications
50
1.0 pF
X8R Dꢁeꢀectrꢁc
VJ hꢁgꢄ
Temperꢂture
FEaTURES
0402
0603
0805
1206
1210
330 pF
470 pF
6.8 nF
33 nF
• Surface-mount multilayer ceramic chip capacitors
• High-operating-temperature dielectric
• Maintains capacitance at high temperature
• AgPd terminations available for silver epoxy
bonding
100
50
X8R
25
100 nF
220 nF
220 nF
• Wet build process
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• High-temperature modules
1.0 nF
10 nF
SELECTOR GUIDE
7/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
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