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VD6725SW PDF预览

VD6725SW

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 传感器
页数 文件大小 规格书
4页 191K
描述
2 megapixel, 1/5 inch system-on-chip imaging sensor

VD6725SW 数据手册

 浏览型号VD6725SW的Datasheet PDF文件第2页浏览型号VD6725SW的Datasheet PDF文件第3页浏览型号VD6725SW的Datasheet PDF文件第4页 
VD6725  
2 megapixel, 1/5 inch system-on-chip imaging sensor  
Data Brief  
Features  
UXGA (2 megapixel) sensor array  
1/5” optical format, 1.75 µm pixel size  
SNR max > 36 dB  
10-bit continuous-time single-end ADC  
Selectable 8-bit parallel or CSI2 serial output  
Integrated high-performance image signal  
processor and camera controller  
– 4-channel radial anti-vignetting  
– dynamic singlet/couplet correction  
– adaptive noise reduction  
Applications  
– high-quality scaler: any size scaling down  
from SXGA  
Mobile phones  
PDAs  
– electronic zoom  
PC cameras and peripherals  
Gaming platforms  
15 frames per second (fps) at full resolution,  
30 fps in VGA with fast context switching  
feature for quicker still image capture  
Programmable I2C chip address  
Description  
Low power consumption and ultra-low standby  
VD6725 is an ultra-small, ultra-competitive and  
ultra-smart 2 megapixel 1/5” SOC imaging sensor  
with a high-performance image signal processor.  
current  
1 Kbit OTP memory fully available to user  
Integrated 1.2 V regulator  
VD6725 imaging sensor allows design of ultra-low  
height camera modules, thanks to ST’s pixel ultra-  
low optical stack height that provides high  
quantum efficiency, better light sensitivity and  
improved relative illumination.  
TSV wafer level package option  
Benefits  
Compatible with camera modules with Z height  
below 4 mm  
This cost competitive solution resulting from an  
ultra-small sensor die size is based on ST’s  
innovative sensor architecture and ST’s latest  
imaging patents, combined to our new imaging  
process.  
Compatible with camera modules < 6 x 6 mm2  
Flexible applications (//ITU, MIPI) using the  
same die  
Creative special effects  
ST’s new high performance imaging process  
provides 1.75 µm pixel size, very high logic  
density, excellent SNR and low light performance.  
It is qualified in our 8” and 12” world-leading  
manufacturing infrastructures.  
Qualified for reflowable camera modules  
January 2008  
Rev 2  
1/4  
For further information contact your local STMicroelectronics sales office.  
www.st.com  
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