Datasheet > V40PWM60CHM3

V40PWM60CHM3

更新时间： 2024-02-08 09:38:29

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
5页	121K
描述
High Current Density Surface Mount Trench MOS Barrier Schottky Rectifier

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V40PWM60CHM3 数据手册

V40PWM60C

Vishay General Semiconductor

www.vishay.com

Epoxy printed circuit

board FR4 copper

thickness = 70 μm

S (cm²)

Copper Pad Areas (cm²)

Fig. 7 - Typical Resistance Junction to Ambient vs.

Copper Pad Areas

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

SlimDPAK (TO-252AE)

(1.40)

(1.20)

0.055

0.047

(0.41)

(0.25)

0.016

0.010

(6.32)

(6.08)

0.249

0.239

(0.70)

(0.30)

0.028

0.012

(6.72)

(6.48)

0.265

0.255

(9.40)

(8.60)

0.370

0.339

(0.20)

(0.00)

(1.40)

(1.00)

0.008

0.000

0.055

0.039

0.090

(2.29)

NOM.

0.180

(4.57)

NOM.

Mounting Pad Layout

0.240

MIN.

(5.70)

(5.30)

0.224

0.209

(6.10)

0.205

(5.20)

0.235

(5.97)

NOM.

MIN.

0.386

(9.80)

REF.

0.075

(1.90)

MIN.

(0.90)

(0.70)

0.035

0.028

0.090

(2.29)

0.055

(1.40)

NOM.

Revision: 01-Jun-17

Document Number: 87695

For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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